Add the backlight device for the LVDS1 output, in preparation for panel
support.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

While commit 3b7e7848 ("arm64: dts: renesas: r8a7795: Add IPMMU
device nodes") for R-Car H3 ES2.0 did include power-domains properties,
they were forgotten in the counterpart for older R-Car H3 ES1.x SoCs.

Fixes: e4b9a493 ("arm64: dts: renesas: r8a7795-es1: Add IPMMU device nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

The R-Car Gen3 HardWare Manual Errata for Rev. 1.00 (Aug 24, 2018)
removed the IPMMU-IR IOMMU instance on R-Car M3-N, as this SoC does not
have an Image Processing Unit (IMP-X5) nor the A3IR power domain.

Fixes: 55697cbb ("arm64: dts: renesas: r8a779{65,80,90}: Add IPMMU devices nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Each CPU can (and does) participate in cooling down the system but the
DT only captures a handful of them, normally CPU0, in the cooling maps.
Things work by chance currently as under normal circumstances its the
first CPU of each cluster which is used by the operating systems to
probe the cooling devices. But as soon as this CPU ordering changes and
any other CPU is used to bring up the cooling device, we will start
seeing failures.

Also the DT is rather incomplete when we list only one CPU in the
cooling maps, as the hardware doesn't have any such limitations.

Update cooling maps to include all devices affected by individual trip
points.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds the thermal device node and the thermal-zone for
the R8A77990 SoC.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch enables I2C DMA.

NOTE: I2C7 DMA is not supported by R-Car Gen3 Hardware User's Manual
Rev.0.80E.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds CMT{0|1|2|3} device nodes for r8a7796 SoC.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

rsnd driver supports SSIU now, let's use it.
Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are
no longer needed.
To avoid git merge timing issue / git bisect issue,
this patch doesn't remove it so far, but will be removed in
the future.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds I2C-DVFS device node for the R8A77990 SoC.

v2
* Drop aliases update as in upstream it is not required to configure the
  BD9571 PMIC for DDR backup, nor is the use of i2c are aliases desired.
* Do not describe the device as compatible with "renesas,rcar-gen3-iic" or
  "renesas,rmobile-iic" fallback compat strings. The absence of automatic
  transmission registers leads us to declare the r8a77990 IIC controller as
  incompatible.

v2.1
* Reduced register range to reflect documentation
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds CAN0,1 and CANFD device nodes for the r8a77990 SoC
and enables CANFD connected to CN10 on the E3 Ebisu board using the
R8A77990 SoC.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds CAN{0,1} and CANFD controller nodes for the R8A77965 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds PCI express channel 0 device node to the R8A77990 SoC
and enables PCIEC0 PCI express controller on the Ebisu board.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Set the capacity-dmips-mhz for R-Car Gen3 SoCs, that is based on
dhrystone. The average in 10 times of dhrystone result as follows:

r8a7795 SoC (A57x4 + A53x4)
  CPU   max-freq   dhrystone
  ---------------------------------
  A57   1500 MHz  11470943 lps/s
  A53   1200 MHz   4798583 lps/s

r8a7796 SoC (A57x2 + A53x4)
  CPU   max-freq   dhrystone
  ---------------------------------
  A57   1500 MHz  11463526 lps/s
  A53   1200 MHz   4793276 lps/s

Based on above, capacity-dmips-mhz values are calculated as follows:

r8a7795 SoC
  A57 : 1024 / (11470943 / 1500) * (11470943 / 1500) = 1024
  A53 : 1024 / (11470943 / 1500) * ( 4798583 / 1200) =  535

r8a7796 SoC
  A57 : 1024 / (11463526 / 1500) * (11463526 / 1500) = 1024
  A53 : 1024 / (11463526 / 1500) * ( 4793276 / 1200) =  535

However, since each CPUs have different max frequencies, the final
CPU capacities of A53 are scaled by this difference, the values are
as follows.

[r8a7795 SoC]
  $ cat /sys/devices/system/cpu/cpu*/cpu_capacity
  1024	<---- CPU capacity of A57
  1024
  1024
  1024
  428	<---- CPU capacity of A53
  428
  428
  428

[r8a7796 SoC]
  $ cat /sys/devices/system/cpu/cpu*/cpu_capacity
  1024	<---- CPU capacity of A57
  1024
  428	<---- CPU capacity of A53
  428
  428
  428
Signed-off-by: Gaku Inami <gaku.inami.xh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds the "cpu-map" into r8a7795/r8a7796 composed of
multi-cluster. This definition is used to parse the cpu topology.
Signed-off-by: Gaku Inami <gaku.inami.xh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Now that include/dt-bindings/clock/r8a774a1-cpg-mssr.h is in Linus'
master branch we can replace clock related magic numbers with the
corresponding labels.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
[simon: corrected whitespace]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Now that include/dt-bindings/power/r8a774a1-sysc.h is in Linus'
master branch we can replace power related magic numbers with
the corresponding labels.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

rsnd driver supports SSIU now, let's use it.
Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are
no longer needed.
To avoid git merge timing issue / git bisect issue,
this patch doesn't remove it so far, but will be removed in
the future.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

The VIN driver bindings dictates fixed numbering for VIN endpoints connected
to CSI-2 endpoints, even when a single endpoint exists.

Without proper endpoint numbering the VIN driver fails to probe.

Based on a patch in BSP from Koji Matsuoka <koji.matsuoka.xm@renesas.com>

Fixes: ec70407a ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: Koji Matsuoka <koji.matsuoka.xm@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds SDHI{0,1,3} device nodes for the r8a77990 SoC
and enables SD card slot connected to SDHI0, micro SD card slot
connected to SDHI1 and eMMC connected to SDHI3 on the Ebisu board
using the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Simon Horman <horms+renesas@verge.net.au>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Cc: linux-renesas-soc@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds pin control for SCIF2 on R8A77990 E3 Ebisu.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

The eMMC card has two supplies, VCC and VCCQ. The VCC supplies the NAND
array and the VCCQ supplies the bus. On Salvator-X and ULCB, the VCC is
connected to 3.3V rail, while the VCCQ is connected to 1.8V rail. Adjust
the pinmux to match the bus, which is always operating in 1.8V mode.

While at it, deduplicate the pinmux entries, which are now the same for
both default and UHS modes. We still need the two pinctrl entries to
match the bindings though.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds the device nodes for all HSCIF serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Describe TMUs in the R8A779{7|8}0 device trees.

Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch enables Audio for the Ebisu board on R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: rebased]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds Audio-DMAC0 device node and Sound device node
for the R8A77990 SoC.

Based on work by Takeshi Kihara and Hai Nguyen Pham.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
[simon: dropped include update, which is already present]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds/enables USB2.0 peripheral for R-Car [DE]3 boards.

R-Car E3 Ebisu board connects the ID pin to the SoC, so this adds
a group "usb0_id" into usb0_pins node. Also, to use SW15 pin 3 side,
this patch adds vbus0_usb2 node on r8a77990-ebisu.dts.

R-Car D3 Draak board doesn't connect the ID pin, so this adds
"renesas,no-otg-pins" property into usb2_phy0 node.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds a property "companion" with xhci0 phandle to
the usb3_peri0 node in salvator-common.dtsi.

About the detail of this property for renesas_usb3 udc driver, please
refer to the commit 39facfa0 ("usb: gadget: udc: renesas_usb3:
Add register of usb role switch").
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Hook up the R-Car E3 AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Hook up the R-Car V3H AVB device to IPMMU-DS1 33 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Hook up the R-Car M3-N AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds/enables USB3.0 peripheral device node for r8a77990
ebisu board.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds the device nodes for SCIF-{0,1,3,4,5} serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Describe MSIOF in the R8A779{7|8}0 device trees.

The DMA props are omitted for R8A77980 as the RT-DMAC isn't supported
(yet?)...

Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Add VIN and CSI-2 nodes to RZ/G2M SoC dtsi.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch revises the reg size of each hsusb device node for
r8a7795, r8a7796 and r8a77965.
Reported-by: Biju Das <biju.das@bp.renesas.com>
Fixes: d2422e10 ("arm64: dts: r8a7795: Add HSUSB device node")
Fixes: 4725f2b8 ("arm64: dts: renesas: r8a7795: add hsusb ch3 device node")
Fixes: b9535853 ("arm64: dts: r8a7796: Add HSUSB device node")
Fixes: 9e1b00a2 ("arm64: dts: renesas: r8a77965: Add "reg" properties")
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

The M3-N (r8a77965) platform has one LVDS encoder connected to the DU.
Add the corresponding DT node and wire it up.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Describe THS/CIVM in the R8A77980 device trees.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Describe THS/CIVM in the R8A77970 device tree.

Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds DMA properties to the MSIOF device nodes of R8A77990 SoC.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Tested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

Describe PWMs in the R8A779{7|8}0 device trees.

Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>