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thermal: sysfs-api.txt - reformat for improved readability 

The document currently uses large indentations which make the text
too wide for easy readability. Also improve general consistency.
Signed-off-by: default avatarFrans Pop <elendil@planet.nl>
Acked-by: default avatarZhang Rui <rui.zhang@intel.com>
Signed-off-by: default avatarAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: default avatarLen Brown <len.brown@intel.com>
parent 625120a4
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Documentation/thermal/sysfs-api.txt
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Generic Thermal Sysfs driver How To
=========================
===================================
Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
......@@ -10,20 +10,20 @@ Copyright (c) 2008 Intel Corporation
0. Introduction
The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors)
and thermal cooling devices (fan, processor...) to register with the thermal management
solution and to be a part of it.
The generic thermal sysfs provides a set of interfaces for thermal zone
devices (sensors) and thermal cooling devices (fan, processor...) to register
with the thermal management solution and to be a part of it.
This how-to focuses on enabling new thermal zone and cooling devices to participate
in thermal management.
This solution is platform independent and any type of thermal zone devices and
cooling devices should be able to make use of the infrastructure.
This how-to focuses on enabling new thermal zone and cooling devices to
participate in thermal management.
This solution is platform independent and any type of thermal zone devices
and cooling devices should be able to make use of the infrastructure.
The main task of the thermal sysfs driver is to expose thermal zone attributes as well
as cooling device attributes to the user space.
An intelligent thermal management application can make decisions based on inputs
from thermal zone attributes (the current temperature and trip point temperature)
and throttle appropriate devices.
The main task of the thermal sysfs driver is to expose thermal zone attributes
as well as cooling device attributes to the user space.
An intelligent thermal management application can make decisions based on
inputs from thermal zone attributes (the current temperature and trip point
temperature) and throttle appropriate devices.
[0-*] denotes any positive number starting from 0
[1-*] denotes any positive number starting from 1
......@@ -31,12 +31,12 @@ and throttle appropriate devices.
1. thermal sysfs driver interface functions
1.1 thermal zone device interface
1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, int trips,
void *devdata, struct thermal_zone_device_ops *ops)
1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name,
int trips, void *devdata, struct thermal_zone_device_ops *ops)
This interface function adds a new thermal zone device (sensor) to
/sys/class/thermal folder as thermal_zone[0-*].
It tries to bind all the thermal cooling devices registered at the same time.
/sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the
thermal cooling devices registered at the same time.
name: the thermal zone name.
trips: the total number of trip points this thermal zone supports.
......@@ -46,8 +46,8 @@ and throttle appropriate devices.
.unbind: unbind the thermal zone device with a thermal cooling device.
.get_temp: get the current temperature of the thermal zone.
.get_mode: get the current mode (user/kernel) of the thermal zone.
"kernel" means thermal management is done in kernel.
"user" will prevent kernel thermal driver actions upon trip points
- "kernel" means thermal management is done in kernel.
- "user" will prevent kernel thermal driver actions upon trip points
so that user applications can take charge of thermal management.
.set_mode: set the mode (user/kernel) of the thermal zone.
.get_trip_type: get the type of certain trip point.
......@@ -57,16 +57,16 @@ and throttle appropriate devices.
1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
This interface function removes the thermal zone device.
It deletes the corresponding entry form /sys/class/thermal folder and unbind all
the thermal cooling devices it uses.
It deletes the corresponding entry form /sys/class/thermal folder and
unbind all the thermal cooling devices it uses.
1.2 thermal cooling device interface
1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name,
void *devdata, struct thermal_cooling_device_ops *)
This interface function adds a new thermal cooling device (fan/processor/...) to
/sys/class/thermal/ folder as cooling_device[0-*].
It tries to bind itself to all the thermal zone devices register at the same time.
This interface function adds a new thermal cooling device (fan/processor/...)
to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself
to all the thermal zone devices register at the same time.
name: the cooling device name.
devdata: device private data.
ops: thermal cooling devices call-backs.
......@@ -77,15 +77,15 @@ and throttle appropriate devices.
1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
This interface function remove the thermal cooling device.
It deletes the corresponding entry form /sys/class/thermal folder and unbind
itself from all the thermal zone devices using it.
It deletes the corresponding entry form /sys/class/thermal folder and
unbind itself from all the thermal zone devices using it.
1.3 interface for binding a thermal zone device with a thermal cooling device
1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev);
This interface function bind a thermal cooling device to the certain trip point
of a thermal zone device.
This interface function bind a thermal cooling device to the certain trip
point of a thermal zone device.
This function is usually called in the thermal zone device .bind callback.
tz: the thermal zone device
cdev: thermal cooling device
......@@ -95,9 +95,9 @@ and throttle appropriate devices.
1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev);
This interface function unbind a thermal cooling device from the certain trip point
of a thermal zone device.
This function is usually called in the thermal zone device .unbind callback.
This interface function unbind a thermal cooling device from the certain
trip point of a thermal zone device. This function is usually called in
the thermal zone device .unbind callback.
tz: the thermal zone device
cdev: thermal cooling device
trip: indicates which trip point the cooling devices is associated with
......@@ -114,153 +114,157 @@ if hwmon is compiled in or built as a module.
Thermal zone device sys I/F, created once it's registered:
/sys/class/thermal/thermal_zone[0-*]:
|-----type: Type of the thermal zone
|-----temp: Current temperature
|-----mode: Working mode of the thermal zone
|-----trip_point_[0-*]_temp: Trip point temperature
|-----trip_point_[0-*]_type: Trip point type
|---type: Type of the thermal zone
|---temp: Current temperature
|---mode: Working mode of the thermal zone
|---trip_point_[0-*]_temp: Trip point temperature
|---trip_point_[0-*]_type: Trip point type
Thermal cooling device sys I/F, created once it's registered:
/sys/class/thermal/cooling_device[0-*]:
|-----type : Type of the cooling device(processor/fan/...)
|-----max_state: Maximum cooling state of the cooling device
|-----cur_state: Current cooling state of the cooling device
|---type: Type of the cooling device(processor/fan/...)
|---max_state: Maximum cooling state of the cooling device
|---cur_state: Current cooling state of the cooling device
These two dynamic attributes are created/removed in pairs.
They represent the relationship between a thermal zone and its associated cooling device.
They are created/removed for each
thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful execution.
Then next two dynamic attributes are created/removed in pairs. They represent
the relationship between a thermal zone and its associated cooling device.
They are created/removed for each successful execution of
thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
/sys/class/thermal/thermal_zone[0-*]
|-----cdev[0-*]: The [0-*]th cooling device in the current thermal zone
|-----cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
/sys/class/thermal/thermal_zone[0-*]:
|---cdev[0-*]: [0-*]th cooling device in current thermal zone
|---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
the generic thermal driver also creates a hwmon sysfs I/F for each _type_ of
thermal zone device. E.g. the generic thermal driver registers one hwmon class device
and build the associated hwmon sysfs I/F for all the registered ACPI thermal zones.
the generic thermal driver also creates a hwmon sysfs I/F for each _type_
of thermal zone device. E.g. the generic thermal driver registers one hwmon
class device and build the associated hwmon sysfs I/F for all the registered
ACPI thermal zones.
/sys/class/hwmon/hwmon[0-*]:
|-----name: The type of the thermal zone devices.
|-----temp[1-*]_input: The current temperature of thermal zone [1-*].
|-----temp[1-*]_critical: The critical trip point of thermal zone [1-*].
|---name: The type of the thermal zone devices
|---temp[1-*]_input: The current temperature of thermal zone [1-*]
|---temp[1-*]_critical: The critical trip point of thermal zone [1-*]
Please read Documentation/hwmon/sysfs-interface for additional information.
***************************
* Thermal zone attributes *
***************************
type Strings which represent the thermal zone type.
type
Strings which represent the thermal zone type.
This is given by thermal zone driver as part of registration.
Eg: "acpitz" indicates it's an ACPI thermal device.
In order to keep it consistent with hwmon sys attribute,
this should be a short, lowercase string,
not containing spaces nor dashes.
RO
Required
temp Current temperature as reported by thermal zone (sensor)
E.g: "acpitz" indicates it's an ACPI thermal device.
In order to keep it consistent with hwmon sys attribute; this should
be a short, lowercase string, not containing spaces nor dashes.
RO, Required
temp
Current temperature as reported by thermal zone (sensor).
Unit: millidegree Celsius
RO
Required
mode One of the predefined values in [kernel, user]
This file gives information about the algorithm
that is currently managing the thermal zone.
It can be either default kernel based algorithm
or user space application.
RW
Optional
RO, Required
mode
One of the predefined values in [kernel, user].
This file gives information about the algorithm that is currently
managing the thermal zone. It can be either default kernel based
algorithm or user space application.
kernel = Thermal management in kernel thermal zone driver.
user = Preventing kernel thermal zone driver actions upon
trip points so that user application can take full
charge of the thermal management.
RW, Optional
trip_point_[0-*]_temp The temperature above which trip point will be fired
trip_point_[0-*]_temp
The temperature above which trip point will be fired.
Unit: millidegree Celsius
RO
Optional
RO, Optional
trip_point_[0-*]_type Strings which indicate the type of the trip point
E.g. it can be one of critical, hot, passive,
active[0-*] for ACPI thermal zone.
RO
Optional
trip_point_[0-*]_type
Strings which indicate the type of the trip point.
E.g. it can be one of critical, hot, passive, active[0-*] for ACPI
thermal zone.
RO, Optional
cdev[0-*] Sysfs link to the thermal cooling device node where the sys I/F
cdev[0-*]
Sysfs link to the thermal cooling device node where the sys I/F
for cooling device throttling control represents.
RO
Optional
RO, Optional
cdev[0-*]_trip_point The trip point with which cdev[0-*] is associated in this thermal zone
-1 means the cooling device is not associated with any trip point.
RO
Optional
cdev[0-*]_trip_point
The trip point with which cdev[0-*] is associated in this thermal
zone; -1 means the cooling device is not associated with any trip
point.
RO, Optional
******************************
*****************************
* Cooling device attributes *
******************************
type String which represents the type of device
eg: For generic ACPI: this should be "Fan",
"Processor" or "LCD"
eg. For memory controller device on intel_menlow platform:
this should be "Memory controller"
RO
Required
max_state The maximum permissible cooling state of this cooling device.
RO
Required
cur_state The current cooling state of this cooling device.
the value can any integer numbers between 0 and max_state,
cur_state == 0 means no cooling
cur_state == max_state means the maximum cooling.
RW
Required
*****************************
type
String which represents the type of device, e.g:
- for generic ACPI: should be "Fan", "Processor" or "LCD"
- for memory controller device on intel_menlow platform:
should be "Memory controller".
RO, Required
max_state
The maximum permissible cooling state of this cooling device.
RO, Required
cur_state
The current cooling state of this cooling device.
The value can any integer numbers between 0 and max_state:
- cur_state == 0 means no cooling
- cur_state == max_state means the maximum cooling.
RW, Required
3. A simple implementation
ACPI thermal zone may support multiple trip points like critical/hot/passive/active.
If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time,
it may register itself as a thermal_zone_device (thermal_zone1) with 4 trip points in all.
It has one processor and one fan, which are both registered as thermal_cooling_device.
If the processor is listed in _PSL method, and the fan is listed in _AL0 method,
the sys I/F structure will be built like this:
ACPI thermal zone may support multiple trip points like critical, hot,
passive, active. If an ACPI thermal zone supports critical, passive,
active[0] and active[1] at the same time, it may register itself as a
thermal_zone_device (thermal_zone1) with 4 trip points in all.
It has one processor and one fan, which are both registered as
thermal_cooling_device.
If the processor is listed in _PSL method, and the fan is listed in _AL0
method, the sys I/F structure will be built like this:
/sys/class/thermal:
|thermal_zone1:
|-----type: acpitz
|-----temp: 37000
|-----mode: kernel
|-----trip_point_0_temp: 100000
|-----trip_point_0_type: critical
|-----trip_point_1_temp: 80000
|-----trip_point_1_type: passive
|-----trip_point_2_temp: 70000
|-----trip_point_2_type: active0
|-----trip_point_3_temp: 60000
|-----trip_point_3_type: active1
|-----cdev0: --->/sys/class/thermal/cooling_device0
|-----cdev0_trip_point: 1 /* cdev0 can be used for passive */
|-----cdev1: --->/sys/class/thermal/cooling_device3
|-----cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
|---type: acpitz
|---temp: 37000
|---mode: kernel
|---trip_point_0_temp: 100000
|---trip_point_0_type: critical
|---trip_point_1_temp: 80000
|---trip_point_1_type: passive
|---trip_point_2_temp: 70000
|---trip_point_2_type: active0
|---trip_point_3_temp: 60000
|---trip_point_3_type: active1
|---cdev0: --->/sys/class/thermal/cooling_device0
|---cdev0_trip_point: 1 /* cdev0 can be used for passive */
|---cdev1: --->/sys/class/thermal/cooling_device3
|---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
|cooling_device0:
|-----type: Processor
|-----max_state: 8
|-----cur_state: 0
|---type: Processor
|---max_state: 8
|---cur_state: 0
|cooling_device3:
|-----type: Fan
|-----max_state: 2
|-----cur_state: 0
|---type: Fan
|---max_state: 2
|---cur_state: 0
/sys/class/hwmon:
|hwmon0:
|-----name: acpitz
|-----temp1_input: 37000
|-----temp1_crit: 100000
|---name: acpitz
|---temp1_input: 37000
|---temp1_crit: 100000
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