the generic thermal sysfs driver

The Generic Thermal sysfs driver for thermal management.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>

Documentation/thermal/sysfs-api.txt

+Generic Thermal Sysfs driver How To
+=========================
+
+Written by Sujith Thomas <sujith.thomas@intel.com>, Zhang Rui <rui.zhang@intel.com>
+
+Updated: 2 January 2008
+
+Copyright (c)  2008 Intel Corporation
+
+
+0. Introduction
+
+The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors)
+and thermal cooling devices (fan, processor...) to register with the thermal management
+solution and to be a part of it.
+
+This how-to focusses on enabling new thermal zone and cooling devices to participate
+in thermal management.
+This solution is platform independent and any type of thermal zone devices and
+cooling devices should be able to make use of the infrastructure.
+
+The main task of the thermal sysfs driver is to expose thermal zone attributes as well
+as cooling device attributes to the user space.
+An intelligent thermal management application can make decisions based on inputs
+from thermal zone attributes (the current temperature and trip point temperature)
+and throttle appropriate devices.
+
+[0-*]	denotes any positive number starting from 0
+[1-*]	denotes any positive number starting from 1
+
+1. thermal sysfs driver interface functions
+
+1.1 thermal zone device interface
+1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, int trips,
+				void *devdata, struct thermal_zone_device_ops *ops)
+
+	This interface function adds a new thermal zone device (sensor) to
+	/sys/class/thermal folder as thermal_zone[0-*].
+	It tries to bind all the thermal cooling devices registered at the same time.
+
+	name: the thermal zone name.
+	trips: the total number of trip points this thermal zone supports.
+	devdata: device private data
+	ops: thermal zone device callbacks.
+		.bind: bind the thermal zone device with a thermal cooling device.
+		.unbind: unbing the thermal zone device with a thermal cooling device.
+		.get_temp: get the current temperature of the thermal zone.
+		.get_mode: get the current mode (user/kernel) of the thermal zone.
+			   "kernel" means thermal management is done in kernel.
+			   "user" will prevent kernel thermal driver actions upon trip points
+			   so that user applications can take charge of thermal management.
+		.set_mode: set the mode (user/kernel) of the thermal zone.
+		.get_trip_type: get the type of certain trip point.
+		.get_trip_temp: get the temperature above which the certain trip point
+				will be fired.
+
+1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz)
+
+	This interface function removes the thermal zone device.
+	It deletes the corresponding entry form /sys/class/thermal folder and unbind all
+	the thermal cooling devices it uses.
+
+1.2 thermal cooling device interface
+1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name,
+					void *devdata, struct thermal_cooling_device_ops *)
+
+	This interface function adds a new thermal cooling device (fan/processor/...) to
+	/sys/class/thermal/ folder as cooling_device[0-*].
+	It tries to bind itself to all the thermal zone devices register at the same time.
+	name: the cooling device name.
+	devdata: device private data.
+	ops: thermal cooling devices callbacks.
+		.get_max_state: get the Maximum throttle state of the cooling device.
+		.get_cur_state: get the Current throttle state of the cooling device.
+		.set_cur_state: set the Current throttle state of the cooling device.
+
+1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev)
+
+	This interface function remove the thermal cooling device.
+	It deletes the corresponding entry form /sys/class/thermal folder and unbind
+	itself from all	the thermal zone devices using it.
+
+1.3 interface for binding a thermal zone device with a thermal cooling device
+1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
+			int trip, struct thermal_cooling_device *cdev);
+
+	This interface function bind a thermal cooling device to the certain trip point
+	of a thermal zone device.
+	This function is usually called in the thermal zone device .bind callback.
+	tz: the thermal zone device
+	cdev: thermal cooling device
+	trip: indicates which trip point the cooling devices is associated with
+		 in this thermal zone.
+
+1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
+				int trip, struct thermal_cooling_device *cdev);
+
+	This interface function unbind a thermal cooling device from the certain trip point
+	of a thermal zone device.
+	This function is usually called in the thermal zone device .unbind callback.
+	tz: the thermal zone device
+	cdev: thermal cooling device
+	trip: indicates which trip point the cooling devices is associated with
+		in this thermal zone.
+
+2. sysfs attributes structure
+
+RO	read only value
+RW	read/write value
+
+All thermal sysfs attributes will be represented under /sys/class/thermal
+/sys/class/thermal/
+
+Thermal zone device sys I/F, created once it's registered:
+|thermal_zone[0-*]:
+	|-----type:			Type of the thermal zone
+	|-----temp:			Current temperature
+	|-----mode:			Working mode of the thermal zone
+	|-----trip_point_[0-*]_temp:	Trip point temperature
+	|-----trip_point_[0-*]_type:	Trip point type
+
+Thermal cooling device sys I/F, created once it's registered:
+|cooling_device[0-*]:
+	|-----type :			Type of the cooling device(processor/fan/...)
+	|-----max_state:		Maximum cooling state of the cooling device
+	|-----cur_state:		Current cooling state of the cooling device
+
+
+These two dynamic attributes are created/removed in pairs.
+They represent the relationship between a thermal zone and its associated cooling device.
+They are created/removed for each
+thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful exection.
+
+|thermal_zone[0-*]
+	|-----cdev[0-*]:		The [0-*]th cooling device in the current thermal zone
+	|-----cdev[0-*]_trip_point:	Trip point that cdev[0-*] is associated with
+
+
+***************************
+* Thermal zone attributes *
+***************************
+
+type				Strings which represent the thermal zone type.
+				This is given by thermal zone driver as part of registration.
+				Eg: "ACPI thermal zone" indicates it's a ACPI thermal device
+				RO
+				Optional
+
+temp				Current temperature as reported by thermal zone (sensor)
+				Unit: degree celsius
+				RO
+				Required
+
+mode				One of the predifned values in [kernel, user]
+				This file gives information about the algorithm
+				that is currently managing the thermal zone.
+				It can be either default kernel based algorithm
+				or user space application.
+				RW
+				Optional
+				kernel	= Thermal management in kernel thermal zone driver.
+				user	= Preventing kernel thermal zone driver actions upon
+					  trip points so that user application can take full
+					  charge of the thermal management.
+
+trip_point_[0-*]_temp		The temperature above which trip point will be fired
+				Unit: degree celsius
+				RO
+				Optional
+
+trip_point_[0-*]_type 		Strings which indicate the type of the trip point
+				Eg. it can be one of critical, hot, passive,
+				    active[0-*] for ACPI thermal zone.
+				RO
+				Optional
+
+cdev[0-*]			Sysfs link to the thermal cooling device node where the sys I/F
+				for cooling device throttling control represents.
+				RO
+				Optional
+
+cdev[0-*]_trip_point		The trip point with which cdev[0-*] is assocated in this thermal zone
+				-1 means the cooling device is not associated with any trip point.
+				RO
+				Optional
+
+******************************
+* Cooling device  attributes *
+******************************
+
+type				String which represents the type of device
+				eg: For generic ACPI: this should be "Fan",
+				"Processor" or "LCD"
+				eg. For memory controller device on intel_menlow platform:
+				this should be "Memory controller"
+				RO
+				Optional
+
+max_state			The maximum permissible cooling state of this cooling device.
+				RO
+				Required
+
+cur_state			The current cooling state of this cooling device.
+				the value can any integer numbers between 0 and max_state,
+				cur_state == 0 means no cooling
+				cur_state == max_state means the maximum cooling.
+				RW
+				Required
+
+3. A simple implementation
+
+ACPI thermal zone may support multiple trip points like critical/hot/passive/active.
+If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time,
+it may register itself as a thermale_zone_device (thermal_zone1) with 4 trip points in all.
+It has one processor and one fan, which are both registered as thermal_cooling_device.
+If the processor is listed in _PSL method, and the fan is listed in _AL0 method,
+the sys I/F structure will be built like this:
+
+/sys/class/thermal:
+
+|thermal_zone1:
+	|-----type:			ACPI thermal zone
+	|-----temp:			37
+	|-----mode:			kernel
+	|-----trip_point_0_temp:	100
+	|-----trip_point_0_type:	critical
+	|-----trip_point_1_temp:	80
+	|-----trip_point_1_type:	passive
+	|-----trip_point_2_temp:	70
+	|-----trip_point_2_type:	active[0]
+	|-----trip_point_3_temp:	60
+	|-----trip_point_3_type:	active[1]
+	|-----cdev0:			--->/sys/class/thermal/cooling_device0
+	|-----cdev0_trip_point:		1	/* cdev0 can be used for passive */
+	|-----cdev1:			--->/sys/class/thermal/cooling_device3
+	|-----cdev1_trip_point:		2	/* cdev1 can be used for active[0]*/
+
+|cooling_device0:
+	|-----type:			Processor
+	|-----max_state:		8
+	|-----cur_state:		0
+
+|cooling_device3:
+	|-----type:			Fan
+	|-----max_state:		2
+	|-----cur_state:		0

drivers/Kconfig

@@ -58,6 +58,8 @@ source "drivers/power/Kconfig"
 
 source "drivers/hwmon/Kconfig"
 
+source "drivers/thermal/Kconfig"
+
 source "drivers/watchdog/Kconfig"
 
 source "drivers/ssb/Kconfig"

drivers/Makefile

@@ -64,6 +64,7 @@ obj-y				+= i2c/
 obj-$(CONFIG_W1)		+= w1/
 obj-$(CONFIG_POWER_SUPPLY)	+= power/
 obj-$(CONFIG_HWMON)		+= hwmon/
+obj-$(CONFIG_THERMAL)		+= thermal/
 obj-$(CONFIG_WATCHDOG)		+= watchdog/
 obj-$(CONFIG_PHONE)		+= telephony/
 obj-$(CONFIG_MD)		+= md/

drivers/thermal/Kconfig

+#
+# Generic thermal sysfs drivers configuration
+#
+
+menuconfig THERMAL
+	bool "Generic Thermal sysfs driver"
+	default y
+	help
+	  Generic Thermal Sysfs driver offers a generic mechanism for
+	  thermal management. Usually it's made up of one or more thermal
+	  zone and cooling device.
+	  each thermal zone contains its own temperature, trip points,
+	  cooling devices.
+	  All platforms with ACPI thermal support can use this driver.
+	  If you want this support, you should say Y here

drivers/thermal/Makefile

+#
+# Makefile for sensor chip drivers.
+#
+
+obj-$(CONFIG_THERMAL)		+= thermal.o

include/linux/thermal.h

+/*
+ *  thermal.h  ($Revision: 0 $)
+ *
+ *  Copyright (C) 2008  Intel Corp
+ *  Copyright (C) 2008  Zhang Rui <rui.zhang@intel.com>
+ *  Copyright (C) 2008  Sujith Thomas <sujith.thomas@intel.com>
+ *
+ * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
+ *  This program is free software; you can redistribute it and/or modify
+ *  it under the terms of the GNU General Public License as published by
+ *  the Free Software Foundation; version 2 of the License.
+ *
+ *  This program is distributed in the hope that it will be useful, but
+ *  WITHOUT ANY WARRANTY; without even the implied warranty of
+ *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the GNU
+ *  General Public License for more details.
+ *
+ *  You should have received a copy of the GNU General Public License along
+ *  with this program; if not, write to the Free Software Foundation, Inc.,
+ *  59 Temple Place, Suite 330, Boston, MA 02111-1307 USA.
+ *
+ * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
+ */
+
+#ifndef __THERMAL_H__
+#define __THERMAL_H__
+
+#include <linux/idr.h>
+#include <linux/device.h>
+
+struct thermal_zone_device;
+struct thermal_cooling_device;
+
+struct thermal_zone_device_ops {
+	int (*bind) (struct thermal_zone_device *,
+		     struct thermal_cooling_device *);
+	int (*unbind) (struct thermal_zone_device *,
+		       struct thermal_cooling_device *);
+	int (*get_temp) (struct thermal_zone_device *, char *);
+	int (*get_mode) (struct thermal_zone_device *, char *);
+	int (*set_mode) (struct thermal_zone_device *, const char *);
+	int (*get_trip_type) (struct thermal_zone_device *, int, char *);
+	int (*get_trip_temp) (struct thermal_zone_device *, int, char *);
+};
+
+struct thermal_cooling_device_ops {
+	int (*get_max_state) (struct thermal_cooling_device *, char *);
+	int (*get_cur_state) (struct thermal_cooling_device *, char *);
+	int (*set_cur_state) (struct thermal_cooling_device *, unsigned int);
+};
+
+#define THERMAL_TRIPS_NONE -1
+#define THERMAL_MAX_TRIPS 10
+#define THERMAL_NAME_LENGTH 20
+struct thermal_cooling_device {
+	int id;
+	char type[THERMAL_NAME_LENGTH];
+	struct device device;
+	void *devdata;
+	struct thermal_cooling_device_ops *ops;
+	struct list_head node;
+};
+
+struct thermal_zone_device {
+	int id;
+	char type[THERMAL_NAME_LENGTH];
+	struct device device;
+	void *devdata;
+	int trips;
+	struct thermal_zone_device_ops *ops;
+	struct list_head cooling_devices;
+	struct idr idr;
+	struct mutex lock;	/* protect cooling devices list */
+	struct list_head node;
+};
+
+struct thermal_zone_device *thermal_zone_device_register(char *, int, void *,
+					struct thermal_zone_device_ops *);
+void thermal_zone_device_unregister(struct thermal_zone_device *);
+
+int thermal_zone_bind_cooling_device(struct thermal_zone_device *, int,
+				     struct thermal_cooling_device *);
+int thermal_zone_unbind_cooling_device(struct thermal_zone_device *, int,
+				       struct thermal_cooling_device *);
+
+struct thermal_cooling_device *thermal_cooling_device_register(char *, void *,
+					struct thermal_cooling_device_ops *);
+void thermal_cooling_device_unregister(struct thermal_cooling_device *);
+
+#endif				/* __THERMAL_H__ */