staging: ti-soc-thermal: update TODO list
This patch removes out of the TODO list those already completed. Here is the status and why they are removed: on ti-bandgap.c: -- Add support to hwmon: REMOVED, no need to have hwmon interfaces as the control is done via thermal framework. -- Test every exposed API to userland: DONE, via thermal fw APIs By now, no specific API is exposed by this driver -- Revisit data structures and simplify them: DONE, all unused fields are flagged for future removal. -- Once SCM-core api settles, update this driver accordingly: DONE, the BG driver can exist without SCM driver by ioremapping its own registers and doing its own locking. on ti-thermal-common.c/ti-thermal.h: -- Revisit trips and its definitions: DONE, for now there is no need to change current definition. Alert based policy will be add in future. -- Revisit trending: DONE, OMAP5 history buffer support has been implemented. Devices without history buffer will use thermal fw trending capability. on omap5-thermal.c -- Add support for GPU cooling: REMOVED: this will not be part of this driver. Must be done in a separated cooling device. generally: -- make checkpatch.pl and sparse happy: DONE, sparse remaining warning is not an issue. -- update documentation: DONE, kernel-doc for ti-bandgap is now available. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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