thermal: cpu_cooling: implement the power cooling device API

Add a basic power model to the cpu cooling device to implement the
power cooling device API.  The power model uses the current frequency,
current load and OPPs for the power calculations.  The cpus must have
registered their OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Documentation/thermal/cpu-cooling-api.txt

@@ -36,8 +36,162 @@ the user. The registration APIs returns the cooling device pointer.
     np: pointer to the cooling device device tree node
     clip_cpus: cpumask of cpus where the frequency constraints will happen.
 
-1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+1.1.3 struct thermal_cooling_device *cpufreq_power_cooling_register(
+    const struct cpumask *clip_cpus, u32 capacitance,
+    get_static_t plat_static_func)
+
+Similar to cpufreq_cooling_register, this function registers a cpufreq
+cooling device.  Using this function, the cooling device will
+implement the power extensions by using a simple cpu power model.  The
+cpus must have registered their OPPs using the OPP library.
+
+The additional parameters are needed for the power model (See 2. Power
+models).  "capacitance" is the dynamic power coefficient (See 2.1
+Dynamic power).  "plat_static_func" is a function to calculate the
+static power consumed by these cpus (See 2.2 Static power).
+
+1.1.4 struct thermal_cooling_device *of_cpufreq_power_cooling_register(
+    struct device_node *np, const struct cpumask *clip_cpus, u32 capacitance,
+    get_static_t plat_static_func)
+
+Similar to cpufreq_power_cooling_register, this function register a
+cpufreq cooling device with power extensions using the device tree
+information supplied by the np parameter.
+
+1.1.5 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
 
     This interface function unregisters the "thermal-cpufreq-%x" cooling device.
 
     cdev: Cooling device pointer which has to be unregistered.
+
+2. Power models
+
+The power API registration functions provide a simple power model for
+CPUs.  The current power is calculated as dynamic + (optionally)
+static power.  This power model requires that the operating-points of
+the CPUs are registered using the kernel's opp library and the
+`cpufreq_frequency_table` is assigned to the `struct device` of the
+cpu.  If you are using CONFIG_CPUFREQ_DT then the
+`cpufreq_frequency_table` should already be assigned to the cpu
+device.
+
+The `plat_static_func` parameter of `cpufreq_power_cooling_register()`
+and `of_cpufreq_power_cooling_register()` is optional.  If you don't
+provide it, only dynamic power will be considered.
+
+2.1 Dynamic power
+
+The dynamic power consumption of a processor depends on many factors.
+For a given processor implementation the primary factors are:
+
+- The time the processor spends running, consuming dynamic power, as
+  compared to the time in idle states where dynamic consumption is
+  negligible.  Herein we refer to this as 'utilisation'.
+- The voltage and frequency levels as a result of DVFS.  The DVFS
+  level is a dominant factor governing power consumption.
+- In running time the 'execution' behaviour (instruction types, memory
+  access patterns and so forth) causes, in most cases, a second order
+  variation.  In pathological cases this variation can be significant,
+  but typically it is of a much lesser impact than the factors above.
+
+A high level dynamic power consumption model may then be represented as:
+
+Pdyn = f(run) * Voltage^2 * Frequency * Utilisation
+
+f(run) here represents the described execution behaviour and its
+result has a units of Watts/Hz/Volt^2 (this often expressed in
+mW/MHz/uVolt^2)
+
+The detailed behaviour for f(run) could be modelled on-line.  However,
+in practice, such an on-line model has dependencies on a number of
+implementation specific processor support and characterisation
+factors.  Therefore, in initial implementation that contribution is
+represented as a constant coefficient.  This is a simplification
+consistent with the relative contribution to overall power variation.
+
+In this simplified representation our model becomes:
+
+Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation
+
+Where `capacitance` is a constant that represents an indicative
+running time dynamic power coefficient in fundamental units of
+mW/MHz/uVolt^2.  Typical values for mobile CPUs might lie in range
+from 100 to 500.  For reference, the approximate values for the SoC in
+ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and
+140 for the Cortex-A53 cluster.
+
+
+2.2 Static power
+
+Static leakage power consumption depends on a number of factors.  For a
+given circuit implementation the primary factors are:
+
+- Time the circuit spends in each 'power state'
+- Temperature
+- Operating voltage
+- Process grade
+
+The time the circuit spends in each 'power state' for a given
+evaluation period at first order means OFF or ON.  However,
+'retention' states can also be supported that reduce power during
+inactive periods without loss of context.
+
+Note: The visibility of state entries to the OS can vary, according to
+platform specifics, and this can then impact the accuracy of a model
+based on OS state information alone.  It might be possible in some
+cases to extract more accurate information from system resources.
+
+The temperature, operating voltage and process 'grade' (slow to fast)
+of the circuit are all significant factors in static leakage power
+consumption.  All of these have complex relationships to static power.
+
+Circuit implementation specific factors include the chosen silicon
+process as well as the type, number and size of transistors in both
+the logic gates and any RAM elements included.
+
+The static power consumption modelling must take into account the
+power managed regions that are implemented.  Taking the example of an
+ARM processor cluster, the modelling would take into account whether
+each CPU can be powered OFF separately or if only a single power
+region is implemented for the complete cluster.
+
+In one view, there are others, a static power consumption model can
+then start from a set of reference values for each power managed
+region (e.g. CPU, Cluster/L2) in each state (e.g. ON, OFF) at an
+arbitrary process grade, voltage and temperature point.  These values
+are then scaled for all of the following: the time in each state, the
+process grade, the current temperature and the operating voltage.
+However, since both implementation specific and complex relationships
+dominate the estimate, the appropriate interface to the model from the
+cpu cooling device is to provide a function callback that calculates
+the static power in this platform.  When registering the cpu cooling
+device pass a function pointer that follows the `get_static_t`
+prototype:
+
+    int plat_get_static(cpumask_t *cpumask, int interval,
+                        unsigned long voltage, u32 &power);
+
+`cpumask` is the cpumask of the cpus involved in the calculation.
+`voltage` is the voltage at which they are operating.  The function
+should calculate the average static power for the last `interval`
+milliseconds.  It returns 0 on success, -E* on error.  If it
+succeeds, it should store the static power in `power`.  Reading the
+temperature of the cpus described by `cpumask` is left for
+plat_get_static() to do as the platform knows best which thermal
+sensor is closest to the cpu.
+
+If `plat_static_func` is NULL, static power is considered to be
+negligible for this platform and only dynamic power is considered.
+
+The platform specific callback can then use any combination of tables
+and/or equations to permute the estimated value.  Process grade
+information is not passed to the model since access to such data, from
+on-chip measurement capability or manufacture time data, is platform
+specific.
+
+Note: the significance of static power for CPUs in comparison to
+dynamic power is highly dependent on implementation.  Given the
+potential complexity in implementation, the importance and accuracy of
+its inclusion when using cpu cooling devices should be assessed on a
+case by case basis.
+

include/linux/cpu_cooling.h

@@ -28,6 +28,9 @@
 #include <linux/thermal.h>
 #include <linux/cpumask.h>
 
+typedef int (*get_static_t)(cpumask_t *cpumask, int interval,
+			    unsigned long voltage, u32 *power);
+
 #ifdef CONFIG_CPU_THERMAL
 /**
  * cpufreq_cooling_register - function to create cpufreq cooling device.
@@ -36,6 +39,10 @@
 struct thermal_cooling_device *
 cpufreq_cooling_register(const struct cpumask *clip_cpus);
 
+struct thermal_cooling_device *
+cpufreq_power_cooling_register(const struct cpumask *clip_cpus,
+			       u32 capacitance, get_static_t plat_static_func);
+
 /**
  * of_cpufreq_cooling_register - create cpufreq cooling device based on DT.
  * @np: a valid struct device_node to the cooling device device tree node.
@@ -45,6 +52,12 @@ cpufreq_cooling_register(const struct cpumask *clip_cpus);
 struct thermal_cooling_device *
 of_cpufreq_cooling_register(struct device_node *np,
 			    const struct cpumask *clip_cpus);
+
+struct thermal_cooling_device *
+of_cpufreq_power_cooling_register(struct device_node *np,
+				  const struct cpumask *clip_cpus,
+				  u32 capacitance,
+				  get_static_t plat_static_func);
 #else
 static inline struct thermal_cooling_device *
 of_cpufreq_cooling_register(struct device_node *np,
@@ -52,6 +65,15 @@ of_cpufreq_cooling_register(struct device_node *np,
 {
 	return ERR_PTR(-ENOSYS);
 }
+
+static inline struct thermal_cooling_device *
+of_cpufreq_power_cooling_register(struct device_node *np,
+				  const struct cpumask *clip_cpus,
+				  u32 capacitance,
+				  get_static_t plat_static_func)
+{
+	return NULL;
+}
 #endif
 
 /**
@@ -67,12 +89,29 @@ cpufreq_cooling_register(const struct cpumask *clip_cpus)
 {
 	return ERR_PTR(-ENOSYS);
 }
+static inline struct thermal_cooling_device *
+cpufreq_power_cooling_register(const struct cpumask *clip_cpus,
+			       u32 capacitance, get_static_t plat_static_func)
+{
+	return NULL;
+}
+
 static inline struct thermal_cooling_device *
 of_cpufreq_cooling_register(struct device_node *np,
 			    const struct cpumask *clip_cpus)
 {
 	return ERR_PTR(-ENOSYS);
 }
+
+static inline struct thermal_cooling_device *
+of_cpufreq_power_cooling_register(struct device_node *np,
+				  const struct cpumask *clip_cpus,
+				  u32 capacitance,
+				  get_static_t plat_static_func)
+{
+	return NULL;
+}
+
 static inline
 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
 {