• Linus Torvalds's avatar
    Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux · 583f2bcf
    Linus Torvalds authored
    Pull thermal updates from Daniel Lezcano:
    
     - Remove duplicate error message for the amlogic driver (Tang Bin)
    
     - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
    
     - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
    
     - Remove duplicate include in ti-bandgap (Zhang Yunkai)
    
     - Assign error code in the error path in the function
       thermal_of_populate_bind_params() (Jia-Ju Bai)
    
     - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
       King)
    
     - Use the device name instead of auto-numbering for a better
       identification of the cooling device (Daniel Lezcano)
    
     - Improve a bit the division accuracy in the power allocator governor
       (Jeson Gao)
    
     - Enable the missing third sensor on msm8976 (Konrad Dybcio)
    
     - Add QCom tsens driver co-maintainer (Thara Gopinath)
    
     - Fix memory leak and use after free errors in the core code (Daniel
       Lezcano)
    
     - Add the MDM9607 compatible bindings (Konrad Dybcio)
    
     - Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
    
     - Fix negative index array access when converting the frequency to
       power in the energy model (Brian-sy Yang)
    
     - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
    
     - Update maintainer file for CPU cooling device section (Lukasz Luba)
    
     - Fix missing put_device on error in the Qcom tsens driver (Guangqing
       Zhu)
    
     - Add compatible DT binding for sm8350 (Robert Foss)
    
     - Add support for the MDM9607's tsens driver (Konrad Dybcio)
    
     - Remove duplicate error messages in thermal_mmio and the bcm2835
       driver (Ruiqi Gong)
    
     - Add the Thermal Temperature Cooling driver (Zhang Rui)
    
     - Remove duplicate error messages in the Hisilicon sensor driver (Ye
       Bin)
    
     - Use the devm_platform_ioremap_resource_byname() function instead of a
       couple of corresponding calls (dingsenjie)
    
     - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
    
     - Add missing property in the DT thermal sensor binding (Rafał Miłecki)
    
     - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
    
     - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
    
     - Replace the thermal_notify_framework() call by a call to the
       thermal_zone_device_update() function. Remove the function as well as
       the corresponding documentation (Thara Gopinath)
    
     - Add support for the ipq8064-tsens sensor along with a set of cleanups
       and code preparation (Ansuel Smith)
    
     - Add a lockless __thermal_cdev_update() function to improve the
       locking scheme in the core code and governors (Lukasz Luba)
    
     - Fix multiple cooling device notification changes (Lukasz Luba)
    
     - Remove unneeded variable initialization (Colin Ian King)
    
    * tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
      thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
      thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
      thermal/core/fair share: Use the lockless __thermal_cdev_update() function
      thermal/core/fair share: Lock the thermal zone while looping over instances
      thermal/core/power_allocator: Update once cooling devices when temp is low
      thermal/core/power_allocator: Maintain the device statistics from going stale
      thermal/core: Create a helper __thermal_cdev_update() without a lock
      dt-bindings: thermal: tsens: Document ipq8064 bindings
      thermal/drivers/tsens: Add support for ipq8064-tsens
      thermal/drivers/tsens: Drop unused define for msm8960
      thermal/drivers/tsens: Replace custom 8960 apis with generic apis
      thermal/drivers/tsens: Fix bug in sensor enable for msm8960
      thermal/drivers/tsens: Use init_common for msm8960
      thermal/drivers/tsens: Add VER_0 tsens version
      thermal/drivers/tsens: Convert msm8960 to reg_field
      thermal/drivers/tsens: Don't hardcode sensor slope
      Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
      thermal/core: Remove thermal_notify_framework
      iwlwifi: mvm: tt: Replace thermal_notify_framework
      dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
      ...
    583f2bcf
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