• Guennadi Liakhovetski's avatar
    mmc: tmio: split core functionality, DMA and MFD glue · b6147490
    Guennadi Liakhovetski authored
    TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to
    the one, used in MN5774 and other MN57xx controllers. These IP cores are
    included in many multifunction devices, in sh-mobile chips from Renesas,
    in the latter case they can also use DMA. Some sh-mobile implementations
    also have some other specialities, that MFD-based solutions don't have.
    This makes supporting all these features in a monolithic driver inconveniet
    and error-prone. This patch splits the driver into 3 parts: the core,
    the MFD glue and the DMA support. In case of a modular build, two modules
    will be built: mmc_tmio_core and mmc_tmio.
    Signed-off-by: default avatarGuennadi Liakhovetski <g.liakhovetski@gmx.de>
    Acked-by: default avatarPaul Mundt <lethal@linux-sh.org>
    Signed-off-by: default avatarChris Ball <cjb@laptop.org>
    b6147490
Makefile 2 KB