Commit 43f9699b authored by Daniel Lezcano's avatar Daniel Lezcano Committed by Heiko Stuebner

arm64: dts: rockchip: Add idle cooling devices to rk3399

The thermal framework accepts now the cpu idle cooling device as an
alternative when the cpufreq cooling device fails.

Add the node in the DT so the cooling devices will be present and the
platforms can extend the thermal zone definition to add them.
Signed-off-by: default avatarDaniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20211001161728.1729664-1-daniel.lezcano@linaro.orgSigned-off-by: default avatarHeiko Stuebner <heiko@sntech.de>
parent 5c9e66c6
......@@ -124,6 +124,12 @@ cpu_b0: cpu@100 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
thermal-idle {
#cooling-cells = <2>;
duration-us = <10000>;
exit-latency-us = <500>;
};
};
cpu_b1: cpu@101 {
......@@ -136,6 +142,12 @@ cpu_b1: cpu@101 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
thermal-idle {
#cooling-cells = <2>;
duration-us = <10000>;
exit-latency-us = <500>;
};
};
idle-states {
......
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