staging: ti-soc-thermal: remove external heat while extrapolating hotspot
For boards that provide a PCB sensor close to SoC junction temperature, it is possible to remove the cumulative heat reported by the SoC temperature sensor. This patch changes the extrapolation computation to consider an external sensor in the extrapolation equations. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Showing
Please register or sign in to comment