- 22 Apr, 2021 12 commits
-
-
Ansuel Smith authored
Document the use of bindings used for msm8960 tsens based devices. msm8960 use the same gcc regs and is set as a child of the qcom gcc. Signed-off-by:
Ansuel Smith <ansuelsmth@gmail.com> Reviewed-by:
Rob Herring <robh@kernel.org> Signed-off-by:
Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
-
Ansuel Smith authored
Add support for tsens present in ipq806x SoCs based on generic msm8960 tsens driver. Signed-off-by:
Thara Gopinath <thara.gopinath@linaro.org> Signed-off-by:
-
Ansuel Smith authored
Drop unused define for msm8960 replaced by generic api and reg_field. Signed-off-by:
-
Ansuel Smith authored
Rework calibrate function to use common function. Derive the offset from a missing hardcoded slope table and the data from the nvmem calib efuses. Drop custom get_temp function and use generic api. Signed-off-by:
-
Ansuel Smith authored
Device based on tsens VER_0 contains a hardware bug that results in some problem with sensor enablement. Sensor id 6-11 can't be enabled selectively and all of them must be enabled in one step. Signed-off-by:
-
Ansuel Smith authored
Use init_common and drop custom init for msm8960. Signed-off-by:
-
Ansuel Smith authored
VER_0 is used to describe device based on tsens version before v0.1. These device are devices based on msm8960 for example apq8064 or ipq806x. Add support for VER_0 in tsens.c and set the right tsens feat in tsens-8960.c file. Signed-off-by:
kernel test robot <lkp@intel.com> Reported-by:
Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by:
-
Ansuel Smith authored
Convert msm9860 driver to reg_field to use the init_common function. Signed-off-by:
-
Ansuel Smith authored
Function compute_intercept_slope hardcode the sensor slope to SLOPE_DEFAULT. Change this and use the default value only if a slope is not defined. This is needed for tsens VER_0 that has a hardcoded slope table. Signed-off-by:
-
Thara Gopinath authored
Since thermal_notify_framework is no longer supported/implemented remove the entry from sysfs-api.rst. Signed-off-by:
-
Thara Gopinath authored
thermal_notify_framework just updates for a single trip point where as thermal_zone_device_update does other bookkeeping like updating the temperature of the thermal zone and setting the next trip point. The only driver that was using thermal_notify_framework was updated in the previous patch to use thermal_zone_device_update instead. Since there are no users for thermal_notify_framework remove it. Signed-off-by:
-
Thara Gopinath authored
thermal_notify_framework just updates for a single trip point where as thermal_zone_device_update does other bookkeeping like updating the temperature of the thermal zone and setting the next trip point etc. Replace thermal_notify_framework with thermal_zone_device_update as the later is more thorough. Acked-by:
Kalle Valo <kvalo@codeaurora.org> Signed-off-by:
-
- 21 Apr, 2021 2 commits
-
-
Rafał Miłecki authored
This helps validating DTS files. Signed-off-by:
Rafał Miłecki <rafal@milecki.pl> Reviewed-by:
-
Lin Ruizhe authored
The function ti_bandgap_restore_ctxt() restores the context at resume time. It checks if the sensor has a counter, reads the register but does nothing with the value. The block was probably omitted by the commit b87ea759. Remove the unused variable as well as the block using it as we can consider it as dead code. Reported-by:
Hulk Robot <hulkci@huawei.com> Fixes: b87ea759 ("staging: omap-thermal: fix context restore function") Signed-off-by:
Lin Ruizhe <linruizhe@huawei.com> Reviewed-by:
Tony Lindgren <tony@atomide.com> Tested-by:
-
- 20 Apr, 2021 8 commits
-
-
Rafał Miłecki authored
This property is required for every thermal sensor as it's used when using phandles. Signed-off-by:
-
Zhen Lei authored
For the sake of lisibility, reorder the header files alphabetically. Signed-off-by:
Zhen Lei <thunder.leizhen@huawei.com> Reviewed-by:
Keerthy <j-keerthy@ti.com> Signed-off-by:
-
dingsenjie authored
Use the devm_platform_ioremap_resource_byname() helper instead of calling platform_get_resource_byname() and devm_ioremap_resource() separately. Signed-off-by:
dingsenjie <dingsenjie@yulong.com> Signed-off-by:
-
Ye Bin authored
There is a error message within devm_ioremap_resource already, so remove the dev_err call to avoid redundant error message. Reported-by:
Ye Bin <yebin10@huawei.com> Signed-off-by:
-
Zhang Rui authored
On Intel processors, the core frequency can be reduced below OS request, when the current temperature reaches the TCC (Thermal Control Circuit) activation temperature. The default TCC activation temperature is specified by MSR_IA32_TEMPERATURE_TARGET. However, it can be adjusted by specifying an offset in degrees C, using the TCC Offset bits in the same MSR register. This patch introduces a cooling devices driver that utilizes the TCC Offset feature. The bigger the current cooling state is, the lower the effective TCC activation temperature is, so that the processors can be throttled earlier before system critical overheats. Note that, on different platforms, the behavior might be different on how fast the setting takes effect, and how much the CPU frequency is reduced. This patch has been tested on a KabyLake mobile platform from me, and also on a CometLake platform from Doug. Signed-off-by:
Zhang Rui <rui.zhang@intel.com> Tested by: Doug Smythies <dsmythies@telus.net> Signed-off-by:
-
Ruiqi Gong authored
There is a error message within devm_ioremap_resource already, so remove the dev_err call to avoid redundant error message. Reported-by:
Ruiqi Gong <gongruiqi1@huawei.com> Signed-off-by:
-
Ruiqi Gong authored
There is a error message within devm_ioremap_resource already, so remove the dev_err call to avoid redundant error message. Reported-by:
Talel Shenhar <talel@amazon.com> Signed-off-by:
-
Konrad Dybcio authored
MDM9607 TSENS IP is very similar to the one of MSM8916, with minor adjustments to various tuning values. Signed-off-by:
Konrad Dybcio <konrad.dybcio@somainline.org> Acked-by:
-
- 15 Apr, 2021 10 commits
-
-
Robert Foss authored
Add tsens bindings for sm8350. Signed-off-by:
Robert Foss <robert.foss@linaro.org> Reviewed-by:
Vinod Koul <vkoul@kernel.org> Acked-by:
Bjorn Andersson <bjorn.andersson@linaro.org> Signed-off-by:
-
Guangqing Zhu authored
Fixes coccicheck error: drivers/thermal/qcom/tsens.c:759:4-10: ERROR: missing put_device; call of_find_device_by_node on line 715, but without a corresponding object release within this function. Fixes: a7ff8297 ("drivers: thermal: tsens: Merge tsens-common.c into tsens.c") Signed-off-by:
Guangqing Zhu <zhuguangqing83@gmail.com> Reviewed-by:
-
Lukasz Luba authored
Update maintainers responsible for CPU cooling on Arm side. Signed-off-by:
Lukasz Luba <lukasz.luba@arm.com> Acked-by:
Viresh Kumar <viresh.kumar@linaro.org> Acked-by:
Javi Merino <javi.merino@kernel.org> Signed-off-by:
-
David Collins authored
Add support for TEMP_ALARM GEN2 PMIC peripherals with digital major revision 1. This revision utilizes a different temperature threshold mapping than earlier revisions. Signed-off-by:
David Collins <collinsd@codeaurora.org> Signed-off-by:
Guru Das Srinagesh <gurus@codeaurora.org> Reviewed-by:
Stephen Boyd <sboyd@kernel.org> Signed-off-by:
-
brian-sy yang authored
Slab OOB issue is scanned by KASAN in cpu_power_to_freq(). If power is limited below the power of OPP0 in EM table, it will cause slab out-of-bound issue with negative array index. Return the lowest frequency if limited power cannot found a suitable OPP in EM table to fix this issue. Backtrace: [<ffffffd02d2a37f0>] die+0x104/0x5ac [<ffffffd02d2a5630>] bug_handler+0x64/0xd0 [<ffffffd02d288ce4>] brk_handler+0x160/0x258 [<ffffffd02d281e5c>] do_debug_exception+0x248/0x3f0 [<ffffffd02d284488>] el1_dbg+0x14/0xbc [<ffffffd02d75d1d4>] __kasan_report+0x1dc/0x1e0 [<ffffffd02d75c2e0>] kasan_report+0x10/0x20 [<ffffffd02d75def8>] __asan_report_load8_noabort+0x18/0x28 [<ffffffd02e6fce5c>] cpufreq_power2state+0x180/0x43c [<ffffffd02e6ead80>] power_actor_set_power+0x114/0x1d4 [<ffffffd02e6fac24>] allocate_power+0xaec/0xde0 [<ffffffd02e6f9f80>] power_allocator_throttle+0x3ec/0x5a4 [<ffffffd02e6ea888>] handle_thermal_trip+0x160/0x294 [<ffffffd02e6edd08>] thermal_zone_device_check+0xe4/0x154 [<ffffffd02d351cb4>] process_one_work+0x5e4/0xe28 [<ffffffd02d352f44>] worker_thread+0xa4c/0xfac [<ffffffd02d360124>] kthread+0x33c/0x358 [<ffffffd02d289940>] ret_from_fork+0xc/0x18 Fixes: 371a3bc7 ("thermal/drivers/cpufreq_cooling: Fix wrong frequency converted from power") Signed-off-by:
brian-sy yang <brian-sy.yang@mediatek.com> Signed-off-by:
Michael Kao <michael.kao@mediatek.com> Reviewed-by:
-
Hao Fang authored
s/Hisilicon/HiSilicon/g. It should use capital S, according to https://www.hisilicon.com/en/terms-of-use. Signed-off-by:
Hao Fang <fanghao11@huawei.com> Signed-off-by:
-
Konrad Dybcio authored
Add the compatible for MDM9607. Signed-off-by:
-
Daniel Lezcano authored
When the function successfully finishes it logs an information about the registration of the cooling device and use its name to build the message. Unfortunately it was freed right before: drivers/thermal/cpuidle_cooling.c:218 __cpuidle_cooling_register() warn: 'name' was already freed. Fix this by freeing after the message happened. Fixes: 6fd1b186 ("thermal/drivers/cpuidle_cooling: Use device name instead of auto-numbering") Reported-by:
-
Daniel Lezcano authored
The following error is reported by kbuild: smatch warnings: drivers/thermal/devfreq_cooling.c:433 of_devfreq_cooling_register_power() warn: passing zero to 'ERR_PTR' Fix the error code by the setting the 'err' variable instead of 'cdev'. Fixes: f8d354e8 ("thermal/drivers/devfreq_cooling: Use device name instead of auto-numbering") Reported-by:
-
Daniel Lezcano authored
Fix the following error: smatch warnings: drivers/thermal/thermal_core.c:1020 __thermal_cooling_device_register() warn: possible memory leak of 'cdev' by freeing the cdev when exiting the function in the error path. Fixes: 58483761 ("thermal/drivers/core: Use a char pointer for the cooling device name") Reported-by:
-
- 19 Mar, 2021 1 commit
-
-
Thara Gopinath authored
Add myself as the maintainer for Qualcomm tsens drivers so that I can help Daniel by taking care of/reviewing changes to these drivers. Signed-off-by:
-
- 17 Mar, 2021 1 commit
-
-
Konrad Dybcio authored
The sensor *is* in fact used and does report temperature. Signed-off-by:
-
- 16 Mar, 2021 1 commit
-
-
jeson.gao authored
The division is used directly in re-divvying up power, the decimal part will be discarded, devices will get less than the extra_actor_power - 1. if using round the division to make the calculation more accurate. For example: actor0 received more than its max_power, it has the extra_power 759 actor1 received less than its max_power, it require extra_actor_power 395 actor2 received less than its max_power, it require extra_actor_power 365 actor1 and actor2 require the total capped_extra_power 760 using division in re-divvying up power actor1 would actually get the extra_actor_power 394 actor2 would actually get the extra_actor_power 364 if using round the division in re-divvying up power actor1 would actually get the extra_actor_power 394 actor2 would actually get the extra_actor_power 365 Signed-off-by:
Jeson Gao <jeson.gao@unisoc.com> Reviewed-by:
-
- 15 Mar, 2021 5 commits
-
-
Daniel Lezcano authored
There is a list with the purpose of grouping the cpufreq cooling device together as described in the comments but actually it is unused, the code evolved since 2012 and the list was no longer needed. Delete the remaining unused list related code. Signed-off-by:
-
Daniel Lezcano authored
Currently the naming of a cooling device is just a cooling technique followed by a number. When there are multiple cooling devices using the same technique, it is impossible to clearly identify the related device as this one is just a number. For instance: thermal-idle-0 thermal-idle-1 thermal-idle-2 thermal-idle-3 etc ... The 'thermal' prefix is redundant with the subsystem namespace. This patch removes the 'thermal prefix and changes the number by the device name. So the naming above becomes: idle-cpu0 idle-cpu1 idle-cpu2 idle-cpu3 etc ... Signed-off-by:
-
Daniel Lezcano authored
Currently the naming of a cooling device is just a cooling technique followed by a number. When there are multiple cooling devices using the same technique, it is impossible to clearly identify the related device as this one is just a number. For instance: thermal-devfreq-0 thermal-devfreq-1 etc ... The 'thermal' prefix is redundant with the subsystem namespace. This patch removes the 'thermal' prefix and changes the number by the device name. So the naming above becomes: devfreq-5000000.gpu devfreq-1d84000.ufshc etc ... Signed-off-by:
-
Daniel Lezcano authored
Currently the naming of a cooling device is just a cooling technique followed by a number. When there are multiple cooling devices using the same technique, it is impossible to clearly identify the related device as this one is just a number. For instance: thermal-cpufreq-0 thermal-cpufreq-1 etc ... The 'thermal' prefix is redundant with the subsystem namespace. This patch removes the 'thermal' prefix and changes the number by the device name. So the naming above becomes: cpufreq-cpu0 cpufreq-cpu4 etc ... Signed-off-by:
-
Daniel Lezcano authored
We want to have any kind of name for the cooling devices as we do no longer want to rely on auto-numbering. Let's replace the cooling device's fixed array by a char pointer to be allocated dynamically when registering the cooling device, so we don't limit the length of the name. Rework the error path at the same time as we have to rollback the allocations in case of error. Tested with a dummy device having the name: "Llanfairpwllgwyngyllgogerychwyrndrobwllllantysiliogogogoch" A village on the island of Anglesey (Wales), known to have the longest name in Europe. Signed-off-by:
Ido Schimmel <idosch@nvidia.com> Link: https://lore.kernel.org/r/20210314111333.16551-1-daniel.lezcano@linaro.org
-
