- 30 Nov, 2018 2 commits
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Geert Uytterhoeven authored
While commit 3b7e7848 ("arm64: dts: renesas: r8a7795: Add IPMMU device nodes") for R-Car H3 ES2.0 did include power-domains properties, they were forgotten in the counterpart for older R-Car H3 ES1.x SoCs. Fixes: e4b9a493 ("arm64: dts: renesas: r8a7795-es1: Add IPMMU device nodes") Signed-off-by:
Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by:
Simon Horman <horms+renesas@verge.net.au>
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Geert Uytterhoeven authored
The R-Car Gen3 HardWare Manual Errata for Rev. 1.00 (Aug 24, 2018) removed the IPMMU-IR IOMMU instance on R-Car M3-N, as this SoC does not have an Image Processing Unit (IMP-X5) nor the A3IR power domain. Fixes: 55697cbb ("arm64: dts: renesas: r8a779{65,80,90}: Add IPMMU devices nodes") Signed-off-by:
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- 26 Nov, 2018 3 commits
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Viresh Kumar authored
Each CPU can (and does) participate in cooling down the system but the DT only captures a handful of them, normally CPU0, in the cooling maps. Things work by chance currently as under normal circumstances its the first CPU of each cluster which is used by the operating systems to probe the cooling devices. But as soon as this CPU ordering changes and any other CPU is used to bring up the cooling device, we will start seeing failures. Also the DT is rather incomplete when we list only one CPU in the cooling maps, as the hardware doesn't have any such limitations. Update cooling maps to include all devices affected by individual trip points. Signed-off-by:
Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by:
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Yoshihiro Kaneko authored
This patch adds the thermal device node and the thermal-zone for the R8A77990 SoC. Signed-off-by:
Yoshihiro Kaneko <ykaneko0929@gmail.com> Tested-by:
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Takeshi Kihara authored
This patch enables I2C DMA. NOTE: I2C7 DMA is not supported by R-Car Gen3 Hardware User's Manual Rev.0.80E. Signed-off-by:
Takeshi Kihara <takeshi.kihara.df@renesas.com> Signed-off-by:
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- 23 Nov, 2018 4 commits
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Biju Das authored
This patch adds CMT{0|1|2|3} device nodes for r8a7796 SoC. Signed-off-by:Biju Das <biju.das@bp.renesas.com> Reviewed-by:
Fabrizio Castro <fabrizio.castro@bp.renesas.com> Signed-off-by:
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Kuninori Morimoto authored
rsnd driver supports SSIU now, let's use it. Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are no longer needed. To avoid git merge timing issue / git bisect issue, this patch doesn't remove it so far, but will be removed in the future. Signed-off-by:
Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by:
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Takeshi Kihara authored
This patch adds I2C-DVFS device node for the R8A77990 SoC. v2 * Drop aliases update as in upstream it is not required to configure the BD9571 PMIC for DDR backup, nor is the use of i2c are aliases desired. * Do not describe the device as compatible with "renesas,rcar-gen3-iic" or "renesas,rmobile-iic" fallback compat strings. The absence of automatic transmission registers leads us to declare the r8a77990 IIC controller as incompatible. v2.1 * Reduced register range to reflect documentation Signed-off-by:
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Marek Vasut authored
This patch adds CAN0,1 and CANFD device nodes for the r8a77990 SoC and enables CANFD connected to CN10 on the E3 Ebisu board using the R8A77990 SoC. Signed-off-by:
Marek Vasut <marek.vasut+renesas@gmail.com> Acked-by:
Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by:
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- 21 Nov, 2018 1 commit
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Takeshi Kihara authored
This patch adds CAN{0,1} and CANFD controller nodes for the R8A77965 SoC. Signed-off-by:
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- 19 Nov, 2018 1 commit
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Takeshi Kihara authored
This patch adds PCI express channel 0 device node to the R8A77990 SoC and enables PCIEC0 PCI express controller on the Ebisu board. Signed-off-by:
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- 15 Nov, 2018 2 commits
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Gaku Inami authored
Set the capacity-dmips-mhz for R-Car Gen3 SoCs, that is based on dhrystone. The average in 10 times of dhrystone result as follows: r8a7795 SoC (A57x4 + A53x4) CPU max-freq dhrystone --------------------------------- A57 1500 MHz 11470943 lps/s A53 1200 MHz 4798583 lps/s r8a7796 SoC (A57x2 + A53x4) CPU max-freq dhrystone --------------------------------- A57 1500 MHz 11463526 lps/s A53 1200 MHz 4793276 lps/s Based on above, capacity-dmips-mhz values are calculated as follows: r8a7795 SoC A57 : 1024 / (11470943 / 1500) * (11470943 / 1500) = 1024 A53 : 1024 / (11470943 / 1500) * ( 4798583 / 1200) = 535 r8a7796 SoC A57 : 1024 / (11463526 / 1500) * (11463526 / 1500) = 1024 A53 : 1024 / (11463526 / 1500) * ( 4793276 / 1200) = 535 However, since each CPUs have different max frequencies, the final CPU capacities of A53 are scaled by this difference, the values are as follows. [r8a7795 SoC] $ cat /sys/devices/system/cpu/cpu*/cpu_capacity 1024 <---- CPU capacity of A57 1024 1024 1024 428 <---- CPU capacity of A53 428 428 428 [r8a7796 SoC] $ cat /sys/devices/system/cpu/cpu*/cpu_capacity 1024 <---- CPU capacity of A57 1024 428 <---- CPU capacity of A53 428 428 428 Signed-off-by:
Gaku Inami <gaku.inami.xh@renesas.com> Reviewed-by:
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Gaku Inami authored
This patch adds the "cpu-map" into r8a7795/r8a7796 composed of multi-cluster. This definition is used to parse the cpu topology. Signed-off-by:
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- 13 Nov, 2018 2 commits
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Fabrizio Castro authored
Now that include/dt-bindings/clock/r8a774a1-cpg-mssr.h is in Linus' master branch we can replace clock related magic numbers with the corresponding labels. Signed-off-by:
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Fabrizio Castro authored
Now that include/dt-bindings/power/r8a774a1-sysc.h is in Linus' master branch we can replace power related magic numbers with the corresponding labels. Signed-off-by:
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- 08 Nov, 2018 4 commits
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Kuninori Morimoto authored
rsnd driver supports SSIU now, let's use it. Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are no longer needed. To avoid git merge timing issue / git bisect issue, this patch doesn't remove it so far, but will be removed in the future. Signed-off-by:
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Jacopo Mondi authored
The VIN driver bindings dictates fixed numbering for VIN endpoints connected to CSI-2 endpoints, even when a single endpoint exists. Without proper endpoint numbering the VIN driver fails to probe. Based on a patch in BSP from Koji Matsuoka <koji.matsuoka.xm@renesas.com> Fixes: ec70407a ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes") Signed-off-by:
Koji Matsuoka <koji.matsuoka.xm@renesas.com> Signed-off-by:
Jacopo Mondi <jacopo+renesas@jmondi.org> Reviewed-by:
Laurent Pinchart <laurent.pinchart@ideasonboard.com> Signed-off-by:
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Takeshi Kihara authored
This patch adds SDHI{0,1,3} device nodes for the r8a77990 SoC and enables SD card slot connected to SDHI0, micro SD card slot connected to SDHI1 and eMMC connected to SDHI3 on the Ebisu board using the R8A77990 SoC. Signed-off-by: -
Takeshi Kihara authored
This patch adds pin control for SCIF2 on R8A77990 E3 Ebisu. Signed-off-by:
Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by:
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- 06 Nov, 2018 1 commit
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Marek Vasut authored
The eMMC card has two supplies, VCC and VCCQ. The VCC supplies the NAND array and the VCCQ supplies the bus. On Salvator-X and ULCB, the VCC is connected to 3.3V rail, while the VCCQ is connected to 1.8V rail. Adjust the pinmux to match the bus, which is always operating in 1.8V mode. While at it, deduplicate the pinmux entries, which are now the same for both default and UHS modes. We still need the two pinctrl entries to match the bindings though. Signed-off-by:
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- 05 Nov, 2018 20 commits
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Takeshi Kihara authored
This patch adds the device nodes for all HSCIF serial ports to the R8A77990 SoC. Signed-off-by:
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Sergei Shtylyov authored
Describe TMUs in the R8A779{7|8}0 device trees. Based on the original (and large) patches by Vladimir Barinov. Signed-off-by:Vladimir Barinov <vladimir.barinov@cogentembedded.com> Signed-off-by:
Sergei Shtylyov <sergei.shtylyov@cogentembedded.com> Signed-off-by:
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Takeshi Kihara authored
This patch enables Audio for the Ebisu board on R8A77990 SoC. Signed-off-by:
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Yoshihiro Kaneko authored
This patch adds Audio-DMAC0 device node and Sound device node for the R8A77990 SoC. Based on work by Takeshi Kihara and Hai Nguyen Pham. Signed-off-by:
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Yoshihiro Shimoda authored
This patch adds/enables USB2.0 peripheral for R-Car [DE]3 boards. R-Car E3 Ebisu board connects the ID pin to the SoC, so this adds a group "usb0_id" into usb0_pins node. Also, to use SW15 pin 3 side, this patch adds vbus0_usb2 node on r8a77990-ebisu.dts. R-Car D3 Draak board doesn't connect the ID pin, so this adds "renesas,no-otg-pins" property into usb2_phy0 node. Signed-off-by:
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Yoshihiro Shimoda authored
This patch adds a property "companion" with xhci0 phandle to the usb3_peri0 node in salvator-common.dtsi. About the detail of this property for renesas_usb3 udc driver, please refer to the commit 39facfa0 ("usb: gadget: udc: renesas_usb3: Add register of usb role switch"). Signed-off-by:
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Magnus Damm authored
Hook up the R-Car E3 AVB device to IPMMU-DS0 16 as described in the data sheet. Signed-off-by:
Magnus Damm <damm@opensource.se> Tested-by:
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Magnus Damm authored
Hook up the R-Car V3H AVB device to IPMMU-DS1 33 as described in the data sheet. Signed-off-by:
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Magnus Damm authored
Hook up the R-Car M3-N AVB device to IPMMU-DS0 16 as described in the data sheet. Signed-off-by:
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Yoshihiro Shimoda authored
This patch adds/enables USB3.0 peripheral device node for r8a77990 ebisu board. Signed-off-by:
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Takeshi Kihara authored
This patch adds the device nodes for SCIF-{0,1,3,4,5} serial ports to the R8A77990 SoC. Signed-off-by: -
Sergei Shtylyov authored
Describe MSIOF in the R8A779{7|8}0 device trees. The DMA props are omitted for R8A77980 as the RT-DMAC isn't supported (yet?)... Based on the original (and large) patches by Vladimir Barinov. Signed-off-by: -
Biju Das authored
Add VIN and CSI-2 nodes to RZ/G2M SoC dtsi. Signed-off-by:
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Yoshihiro Shimoda authored
This patch revises the reg size of each hsusb device node for r8a7795, r8a7796 and r8a77965. Reported-by:
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Laurent Pinchart authored
The M3-N (r8a77965) platform has one LVDS encoder connected to the DU. Add the corresponding DT node and wire it up. Signed-off-by:
Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Reviewed-by:
Kieran Bingham <kieran.bingham+renesas@ideasonboard.com> Signed-off-by:
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Sergei Shtylyov authored
Describe THS/CIVM in the R8A77980 device trees. Signed-off-by:
Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by:
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Sergei Shtylyov authored
Describe THS/CIVM in the R8A77970 device tree. Based on the original (and large) patches by Vladimir Barinov. Signed-off-by:
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Yoshihiro Kaneko authored
This patch adds DMA properties to the MSIOF device nodes of R8A77990 SoC. Signed-off-by:
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Sergei Shtylyov authored
Describe PWMs in the R8A779{7|8}0 device trees. Based on the original (and large) patches by Vladimir Barinov. Signed-off-by: -
Takeshi Kihara authored
This patch adds a device node for the Interrupt Controller for External Devices (INTC-EX) on R-Car E3, which serves external IRQ pins IRQ[0-5]. Signed-off-by:
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