Merge int340x thermal driver updates, PCH thermal driver updates and
miscellaneous thermal control updates for 5.19-rc1:

 - Clean up _OSC handling in int340x (Davidlohr Bueso).

 - Improve overheat condition handling during suspend-to-idle in the
   Intel PCH thermal driver (Zhang Rui).

 - Use local ops instead of global ops in devfreq_cooling (Kant Fan).

 - Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
   (Hesham Almatary)

* thermal-int340x:
  thermal: int340x: Clean up _OSC context init
  thermal: int340x: Consolidate freeing of acpi_buffer pointer
  thermal: int340x: Clean up unnecessary acpi_buffer pointer freeing

* thermal-pch:
  thermal: intel: pch: improve the cooling delay log
  thermal: intel: pch: enhance overheat handling
  thermal: intel: pch: move cooling delay to suspend_noirq phase
  PM: wakeup: expose pm_wakeup_pending to modules

* thermal-misc:
  thermal: devfreq_cooling: use local ops instead of global ops
  thermal: hisi_termal: Switch from CONFIG_PM_SLEEP guards to pm_sleep_ptr()

Previously, during suspend, intel_pch_thermal driver logs for every
cooling iteration, about the current PCH temperature and number of cooling
iterations that have been tried, like below

[  100.955526] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 1 times for 100 ms duration
[  101.064156] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 2 times for 100 ms duration

After changing the default delay_cnt to 600, in practice, it is common to
see tens of the above messages if the system is suspended when PCH
overheats. Thus, change this log message from dev_warn to dev_dbg because
it is only useful when we want to check the temperature trend.

At the same time, there is always a one-line message given by the driver
with the patch applied, with below four possibilities.

1. PCH is cool, no cooling delay needed
[ 1791.902853] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [48C]

2. PCH overheats and becomes cool after the cooling delays
[ 1475.511617] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [49C] after 30700 ms delay

3. PCH still overheats after the overall cooling timeout
[ 2250.157487] intel_pch_thermal 0000:00:12.0: CPU-PCH is hot [60C] after 60000 ms delay. S0ix might fail

4. PCH aborts cooling because of wakeup event detected during the delay
[ 1933.639509] intel_pch_thermal 0000:00:12.0: Wakeup event detected, abort cooling
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Commit ef63b043 ("thermal: intel: pch: fix S0ix failure due to PCH
temperature above threshold") introduces delay loop mechanism that allows
PCH temperature to go down below threshold during suspend so it won't
block S0ix. And the default overall delay timeout is 1 second.

However, in practice, we found that the time it takes to cool the PCH down
below threshold highly depends on the initial PCH temperature when the
delay starts, as well as the ambient temperature.
And in some cases, the 1 second delay is not sufficient. As a result, the
system stays in a shallower power state like PCx instead of S0ix, and
drains the battery power, without user' notice.

To make sure S0ix is not blocked by the PCH overheating, we
1. expand the default overall timeout to 60 seconds.
2. make sure the temperature is below threshold rather than equal to it.

At the same time, as the cooling delay can be much longer and many wakeup
events (ACPI Power Button press, USB mouse move, etc) becomes valid in the
suspend_noirq phase, add detection of wakeup event so that the driver
does not delay blindly when the system suspend is likely to abort soon.

This patch may introduce longer suspend time, but only in the cases when
the system overheats and Linux used to enter a shallower S2idle state,
say, PCx instead of S0ix.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Move the PCH Thermal driver suspend callback to suspend_noirq to do
cooling while the system is more quiescent.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

intel_pch_thermal driver needs a long delay to cool itself (60 seconds
in maximum) during suspend. When a wakeup event occures during the
delay, it is better for the intel_pch_thermal driver to detect this and
quit cooling because the suspend is likely to abort anyway.

Thus expose pm_wakeup_pending to modules so that intel_pch_thermal
driver can be aware of the wakeup events.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Pull thermal control material for 5.19-rc1 from Daniel Lezcano:

 - Add the new k3 j72xx bangdap driver and the corresponding bindings (Keerthy)

 - Fix the missing of_node_put() in the SC iMX driver at probe timer (Miaoqian Lin)

 - Fix memory leak in __thermal_cooling_device_register() when device_register()
   fails by calling thermal_cooling_device_destroy_sysfs() (Yang Yingliang)

 - Add sc8180x and sc8280xp compatible string in the DT bindings and lMH support
   for QCom tsens driver (Bjorn Andersson)

 - Fix OTP Calibration Register values conforming to the documentation on RZ/G2L
   and bindings documentation for RZ/G2UL (Biju Das)

 - Fix type in kerneldoc description for __thermal_bind_params (Corentin Labbe)

 - Remove unneeded semi colon in libthermal and tools thermal as reported by
   cocci (Jiapeng Chong)

 - Fix potential NULL dereference in sr_thermal_probe() on Broadcom platform
   (Zheng Yongjun)

 - Add thermal library and thermal tools to encapsulate the netlink into event
   based callbacks (Daniel Lezcano)

 - Add change mode ops for the thermal-of sensor (Manaf Meethalavalappu
   Pallikunhi)

 - Fix non negative value support by preventing the value to be clamp to zero
   (Stefan Wahren)

 - Add compatible string and DT bindings for MSM8960 tsens driver (Dmitry
   Baryshkov)

 - Add hwmon support for K3 driver (Massimiliano Minella)

 - Refactor and add multiple generations support for QCom ADC driver (Jishnu
   Prakash)

 - Use platform_get_irq_optional() to get the interrupt on RCar driver and
   document Document RZ/V2L bindings (Lad Prabhakar)

* tag 'thermal-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (28 commits)
  thermal: k3_j72xx_bandgap: Add the bandgap driver support
  dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
  thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
  thermal/core: Fix memory leak in __thermal_cooling_device_register()
  dt-bindings: thermal: tsens: Add sc8280xp compatible
  dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
  thermal/drivers/qcom/lmh: Add sc8180x compatible
  thermal/drivers/rz2gl: Fix OTP Calibration Register values
  dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
  thermal: thermal_of: fix typo on __thermal_bind_params
  tools/thermal: remove unneeded semicolon
  tools/lib/thermal: remove unneeded semicolon
  thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
  tools/thermal: Add thermal daemon skeleton
  tools/thermal: Add a temperature capture tool
  tools/thermal: Add util library
  tools/lib/thermal: Add a thermal library
  thermal/drivers/thermal_of: Add change_mode ops support for thermal_of sensor
  thermal/drivers/bcm2711: Don't clamp temperature at zero
  thermal/drivers/tsens: Add compat string for the qcom,msm8960
  ...

Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported.  There are no
active/passive cooling agent supported.

J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455

The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these  register values when translating the Temperature
Monitor output codes to temperature values.

It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.

-40C to 30C
30C to 125C
125C to 150C

With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.

Tested temperature reading on J721e SoC & J7200 SoC.

[daniel.lezcano@linaro.org: Generate look-up tables run-time]
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

of_find_node_by_name() returns a node pointer with refcount
incremented, we should use of_node_put() on it when done.
Add missing of_node_put() to avoid refcount leak.

Fixes: e20db70d ("thermal: imx_sc: add i.MX system controller thermal support")
Signed-off-by: Miaoqian Lin <linmq006@gmail.com>
Link: https://lore.kernel.org/r/20220517055121.18092-1-linmq006@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

I got memory leak as follows when doing fault injection test:

unreferenced object 0xffff888010080000 (size 264312):
  comm "182", pid 102533, jiffies 4296434960 (age 10.100s)
  hex dump (first 32 bytes):
    00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00  .....N..........
    ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff  ........@.......
  backtrace:
    [<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969
    [<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510
    [<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586
    [<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927
    [<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041
    [<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211
    [<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561

If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called
to free the memory allocated in thermal_cooling_device_setup_sysfs().

Fixes: 8ea22951 ("thermal: Add cooling device's statistics in sysfs")
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Link: https://lore.kernel.org/r/20220511020605.3096734-1-yangyingliang@huawei.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add compatible for the LMh blocks found in the Qualcomm sc8180x
platform.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220502164504.3972938-2-bjorn.andersson@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

The LMh instances in the Qualcomm SC8180X platform looks to behave
similar to those in SM8150, add additional compatibles to allow
platform specific behavior to be added if needed.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220502164504.3972938-1-bjorn.andersson@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

As per the latest RZ/G2L Hardware User's Manual (Rev.1.10 Apr, 2022),
the bit 31 of TSU OTP Calibration Register(OTPTSUTRIM) indicates
whether bit [11:0] of OTPTSUTRIM is valid or invalid.

This patch updates the code to reflect this change.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220428093346.7552-1-biju.das.jz@bp.renesas.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Document RZ/G2UL TSU bindings. The TSU block on RZ/G2UL is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220501081930.23743-1-biju.das.jz@bp.renesas.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add a missing s to __thermal_bind_param kernel doc comment.
This fixes the following sparse warnings:
drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Link: https://lore.kernel.org/r/20220426064113.3787826-1-clabbe@baylibre.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Fix the following coccicheck warnings:

./tools/thermal/thermometer/thermometer.c:147:3-4: Unneeded semicolon.
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Jiapeng Chong <jiapeng.chong@linux.alibaba.com>
Link: https://lore.kernel.org/r/20220427030619.81556-2-jiapeng.chong@linux.alibaba.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Fix the following coccicheck warnings:

./tools/lib/thermal/commands.c:215:2-3: Unneeded semicolon.
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Jiapeng Chong <jiapeng.chong@linux.alibaba.com>
Link: https://lore.kernel.org/r/20220427030619.81556-1-jiapeng.chong@linux.alibaba.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

platform_get_resource() may return NULL, add proper check to
avoid potential NULL dereferencing.

Fixes: 250e2110 ("thermal: broadcom: Add Stingray thermal driver")
Signed-off-by: Zheng Yongjun <zhengyongjun3@huawei.com>
Link: https://lore.kernel.org/r/20220425092929.90412-1-zhengyongjun3@huawei.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

This change provides a simple daemon skeleton. It is an example of how
to use the thermal library which wraps all the complex code related to
the netlink and transforms it into a callback oriented code.

The goal of this skeleton is to give a base brick for anyone
interested in writing its own thermal engine or as an example to rely
on to write its own thermal monitoring implementation.

In the future, it will evolve with more features and hopefully more
logic.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lore.kernel.org/r/20220420160933.347088-5-daniel.lezcano@linaro.org

The 'thermometer' tool allows to capture the temperature of a set of
thermal zones defined in a configuration file at a specified rate.

It is designed to have the lowest possible overhead. It will write the
captured temperature per thermal zone per file so making easier to
write a gnuplot script.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lore.kernel.org/r/20220420160933.347088-4-daniel.lezcano@linaro.org

The next changes will provide a couple of tools using some common
functions provided by this library.

It provides basic wrappers for:

 - mainloop
 - logging
 - timestamp
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lore.kernel.org/r/20220420160933.347088-3-daniel.lezcano@linaro.org

The thermal framework implements a netlink notification mechanism to
be used by the userspace to have a thermal configuration discovery,
trip point changes or violation, cooling device changes notifications,
etc...

This library provides a level of abstraction for the thermal netlink
notification allowing the userspace to connect to the notification
mechanism more easily. The library is callback oriented.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lore.kernel.org/r/20220420160933.347088-2-daniel.lezcano@linaro.org

The sensor driver which register through thermal_of interface doesn't
have an option to get thermal zone mode change notification from
thermal core.

Add support for change_mode ops in thermal_of interface so that sensor
driver can use this ops for mode change notification.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Link: https://lore.kernel.org/r/1646767586-31908-1-git-send-email-quic_manafm@quicinc.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

The thermal sensor on BCM2711 is capable of negative temperatures, so don't
clamp the measurements at zero. Since this was the only use for variable t,
drop it.

This change based on a patch by Dom Cobley, who also tested the fix.

Fixes: 59b78135 ("thermal: Add BCM2711 thermal driver")
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20220412195423.104511-1-stefan.wahren@i2se.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

On apq8064 (msm8960) platforms the tsens device is created manually by
the gcc driver. Prepare the tsens driver for the qcom,msm8960-tsens
device instantiated from the device tree.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-3-dmitry.baryshkov@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Expose the thermal sensors on K3 AM654 as hwmon devices, so that
temperatures could be read using lm-sensors.
Signed-off-by: Massimiliano Minella <massimiliano.minella@gmail.com>
Link: https://lore.kernel.org/r/20220401151656.913166-1-massimiliano.minella@se.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add support for PMIC5 Gen2 ADC_TM, used on PMIC7 chips. It is a
close counterpart of PMIC7 ADC and has the same functionality as
PMIC5 ADC_TM, for threshold monitoring and interrupt generation.
It is present on PMK8350 alone, like PMIC7 ADC and can be used
to monitor up to 8 ADC channels, from any of the PMIC7 PMICs
having ADC on a target, through PBS(Programmable Boot Sequence).
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/1648991869-20899-5-git-send-email-quic_jprakash@quicinc.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Refactor code to support multiple generations of ADC_TM devices
by defining gen number, irq name and disable, configure, isr and
init APIs in the individual data structs.
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/1648991869-20899-4-git-send-email-quic_jprakash@quicinc.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add reverse scaling function for PMIC5 Gen2 ADC_TM, to convert
temperature to raw ADC code, for setting thresholds for
thermistor channels.
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/1648991869-20899-3-git-send-email-quic_jprakash@quicinc.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add documentation for PMIC5 Gen2 ADC_TM peripheral.
It is used for monitoring ADC channel thresholds for PMIC7-type
PMICs. It is present on PMK8350, like PMIC7 ADC and can be used
to monitor up to 8 ADC channels, from any of the PMIC7 PMICs
on a target, through PBS(Programmable Boot Sequence).
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1648991869-20899-2-git-send-email-quic_jprakash@quicinc.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

platform_get_resource(pdev, IORESOURCE_IRQ, ..) relies on static
allocation of IRQ resources in DT core code, this causes an issue
when using hierarchical interrupt domains using "interrupts" property
in the node as this bypasses the hierarchical setup and messes up the
irq chaining.

In preparation for removal of static setup of IRQ resource from DT core
code use platform_get_irq_optional().
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220110144039.5810-1-prabhakar.mahadev-lad.rj@bp.renesas.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Document RZ/V2L TSU bindings. The TSU block on RZ/V2L is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220308212315.4551-1-prabhakar.mahadev-lad.rj@bp.renesas.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

container_of() will never return NULL, so remove useless code.
Signed-off-by: Haowen Bai <baihaowen@meizu.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Merge tag 'driver-core-5.18-rc7' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/driver-core

Pull driver core fixes from Greg KH:
 "Here is one fix, and three documentation updates for 5.18-rc7.

  The fix is for the firmware loader which resolves a long-reported
  problem where the credentials of the firmware loader could be set to a
  userspace process without enough permissions to actually load the
  firmware image. Many Android vendors have been reporting this for
  quite some time.

  The documentation updates are for the embargoed-hardware-issues.rst
  file to add a new entry, change an existing one, and sort the list to
  make changes easier in the future.

  All of these have been in linux-next for a while with no reported
  issues"

* tag 'driver-core-5.18-rc7' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/driver-core:
  Documentation/process: Update ARM contact for embargoed hardware issues
  Documentation/process: Add embargoed HW contact for Ampere Computing
  Documentation/process: Make groups alphabetical and use tabs consistently
  firmware_loader: use kernel credentials when reading firmware

Pull char/misc driver fixes from Greg KH:
 "Here are two small driver fixes for 5.18-rc7 that resolve reported
  problems:

   - slimbus driver irq bugfix

   - interconnect sync state bugfix

  Both of these have been in linux-next with no reported problems"

* tag 'char-misc-5.18-rc7' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc:
  slimbus: qcom: Fix IRQ check in qcom_slim_probe
  interconnect: Restore sync state by ignoring ipa-virt in provider count