- 22 May, 2020 14 commits
-
-
Amit Kucheria authored
cpufreq_cooling cannot be modular, remove the unnecessary module.h include and replace with export.h to handle EXPORT_SYMBOL family of macros. Signed-off-by:
Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by:
Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/7a439e41e91d8bc5ff99207f99723fcf04ca36eb.1589199124.git.amit.kucheria@linaro.org
-
Amit Kucheria authored
Sort headers to make it easier to read and find duplicate headers. Signed-off-by:
-
Amit Kucheria authored
It is preferrable to include export.h when you are using EXPORT_SYMBOL family of macros. Signed-off-by:
-
Amit Kucheria authored
Sort headers to make it easier to read and find duplicate headers. Signed-off-by:
-
Amit Kucheria authored
It is preferable to include export.h when you are using EXPORT_SYMBOL family of macros. Signed-off-by:
-
Amit Kucheria authored
Sort headers to make it easier to read and find duplicate headers. Signed-off-by:
-
Amit Kucheria authored
It is preferable to include export.h when you are using EXPORT_SYMBOL family of macros. Signed-off-by:
-
Amit Kucheria authored
Sort headers to make it easier to read and find duplicate headers. Signed-off-by:
-
Amit Kucheria authored
Thermal core cannot be modular, remove the unnecessary module.h include and replace with export.h to handle EXPORT_SYMBOL family of macros. Signed-off-by:
-
Amit Kucheria authored
The thermal framework can no longer be compiled as a module as of commit 554b3529 ("thermal/drivers/core: Remove the module Kconfig's option"). Remove the MODULE_* tags. Rui is mentioned in the copyright line at the top of the file and the license is mentioned in the SPDX tags. So no loss of information. Signed-off-by:
-
Gustavo A. R. Silva authored
The current codebase makes use of the zero-length array language extension to the C90 standard, but the preferred mechanism to declare variable-length types such as these ones is a flexible array member[1][2], introduced in C99: struct foo { int stuff; struct boo array[]; }; By making use of the mechanism above, we will get a compiler warning in case the flexible array does not occur last in the structure, which will help us prevent some kind of undefined behavior bugs from being inadvertently introduced[3] to the codebase from now on. Also, notice that, dynamic memory allocations won't be affected by this change: "Flexible array members have incomplete type, and so the sizeof operator may not be applied. As a quirk of the original implementation of zero-length arrays, sizeof evaluates to zero."[1] sizeof(flexible-array-member) triggers a warning because flexible array members have incomplete type[1]. There are some instances of code in which the sizeof operator is being incorrectly/erroneously applied to zero-length arrays and the result is zero. Such instances may be hiding some bugs. So, this work (flexible-array member conversions) will also help to get completely rid of those sorts of issues. This issue was found with the help of Coccinelle. [1] https://gcc.gnu.org/onlinedocs/gcc/Zero-Length.html [2] https://github.com/KSPP/linux/issues/21 [3] commit 76497732 ("cxgb3/l2t: Fix undefined behaviour") Signed-off-by:Gustavo A. R. Silva <gustavoars@kernel.org> Signed-off-by:
-
Amit Kucheria authored
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by:
Rob Herring <robh@kernel.org> Reviewed-by:
Lukasz Luba <lukasz.luba@arm.com> Signed-off-by:
-
Amit Kucheria authored
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. CPUs, GPUs) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by:
-
Amit Kucheria authored
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by:
-
- 19 May, 2020 4 commits
-
-
Daniel Lezcano authored
The cpuidle driver can be used as a cooling device by injecting idle cycles. When the property is set, register the cpuidle driver with the idle state node pointer as a cooling device. The thermal framework will do the association automatically with the thermal zone via the cooling-device defined in the device tree cooling-maps section. Signed-off-by:
Sudeep Holla <sudeep.holla@arm.com> Link: https://lore.kernel.org/r/20200429103644.5492-4-daniel.lezcano@linaro.org
-
Daniel Lezcano authored
Today, there is no user for the cpuidle cooling device. The targetted platform is ARM and ARM64. The cpuidle and the cpufreq cooling device are based on the device tree. As the cpuidle cooling device can have its own configuration depending on the platform and the available idle states. The DT node description will give the optional properties to set the cooling device up. Do no longer rely on the CPU node which is prone to error and will lead to a confusion in the DT because the cpufreq cooling device is also using it. Let initialize the cpuidle cooling device with the DT binding. This was tested on: - hikey960 - hikey6220 - rock960 - db845c Acked-by:
Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by:
-
Daniel Lezcano authored
Some devices are not able to cool down by reducing their voltage / frequency because it could be not available or the system does not allow voltage scaling. In this configuration, it is not possible to use this strategy and the idle injection cooling device can be used instead. One idle cooling device is now present for the CPU as implemented by the combination of the idle injection framework belonging to the power capping framework and the thermal cooling device. The missing part is the DT binding providing a way to describe how the cooling device will work on the system. A first iteration was done by making the cooling device to point to the idle state. Unfortunately it does not make sense because it would need to duplicate the idle state description for each CPU in order to have a different phandle and make the thermal internal framework happy. It was proposed to add an cooling-cells to <3>, unfortunately the thermal framework is expecting a value of <2> as stated by the documentation and it is not possible from the cooling device generic code to loop this third value to the back end cooling device. Another proposal was to add a child 'thermal-idle' node as the SCMI does. This approach allows to have a self-contained configuration for the idle cooling device without colliding with the cpufreq cooling device which is based on the CPU node. In addition, it allows to have the cpufreq cooling device and the idle cooling device to co-exist together as shown in the example. Reviewed-by:
-
Daniel Lezcano authored
Currently the idle injection framework uses the play_idle() function which puts the current CPU in an idle state. The idle state is the deepest one, as specified by the latency constraint when calling the subsequent play_idle_precise() function with the INT_MAX. The idle_injection is used by the cpuidle_cooling device which computes the idle / run duration to mitigate the temperature by injecting idle cycles. The cooling device has no control on the depth of the idle state. Allow finer control of the idle injection mechanism by allowing to specify the latency for the idle state. Thus the cooling device has the ability to have a guarantee on the exit latency of the idle states it is injecting. Acked-by:
Rafael J. Wysocki <rafael.j.wysocki@intel.com> Signed-off-by:
-
- 29 Apr, 2020 1 commit
-
-
Sudip Mukherjee authored
On error the function ti_bandgap_get_sensor_data() returns the error code in ERR_PTR() but we only checked if the return value is NULL or not. And, so we can dereference an error code inside ERR_PTR. While at it, convert a check to IS_ERR_OR_NULL. Signed-off-by:
Sudip Mukherjee <sudipm.mukherjee@gmail.com> Reviewed-by:
-
- 28 Apr, 2020 1 commit
-
-
Niklas Söderlund authored
Add an entry to make myself a maintainer of the Renesas R-Car thermal drivers. Signed-off-by:
Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Acked-by:
Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by:
-
- 15 Apr, 2020 1 commit
-
-
Andrzej Pietrasiewicz authored
int3400_thermal_ops is used inside int3400_thermal_probe() only after the assignments, which can just as well be made statically at struct's initizer. Signed-off-by:
Andrzej Pietrasiewicz <andrzej.p@collabora.com> Reviewed-by:
Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Signed-off-by:
-
- 14 Apr, 2020 16 commits
-
-
Keerthy authored
Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. Signed-off-by:
Keerthy <j-keerthy@ti.com> Reviewed-by:
-
Keerthy authored
Add VTM bindings documentation. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Signed-off-by:
-
Markus Elfring authored
The function “platform_get_irq” can log an error already. Thus omit redundant messages for the exception handling in the calling functions. This issue was detected by using the Coccinelle software. Signed-off-by:
Markus Elfring <elfring@users.sourceforge.net> Reviewed-by:
-
Daniel Lezcano authored
All users of the function depends on THERMAL, no stub is needed. Remove it. Signed-off-by:
Zhang Rui <rui.zhang@intel.com> Link: https://lore.kernel.org/r/20200402142747.8307-9-daniel.lezcano@linaro.org
-
Daniel Lezcano authored
All callers of the functions depends on THERMAL, it is pointless to define stubs. Remove them. Signed-off-by:
-
Daniel Lezcano authored
The thermal framework can not be compiled as a module. The IS_ENABLED macro is useless here and can be replaced by an ifdef. Signed-off-by:
-
Daniel Lezcano authored
The function is not used any place other than the thermal directory. It does not make sense to export its definition in the global header as there is no use of it. Move the definition to the internal header and allow better self-encapsulation. Take the opportunity to add the parameter names to make checkpatch happy and remove the pointless stubs. Signed-off-by:
-
Daniel Lezcano authored
The function is not used any place other than the thermal directory. It does not make sense to export its definition in the global header as there is no use of it. Move the definition to the internal header and allow better self-encapsulation. Take the opportunity to add the parameter names to make checkpatch happy and remove the pointless stubs. Signed-off-by:
-
Daniel Lezcano authored
The struct thermal_trip is only used by the thermal internals, it is pointless to export the definition in the global header. Move the structure to the thermal_core.h internal header. Signed-off-by:
-
Daniel Lezcano authored
The exported IPA functions are used by the IPA. It is pointless to declare the functions in the thermal.h file. For better self-encapsulation and less impact for the compilation if a change is made on it. Move the code in the thermal core internal header file. As the users depends on THERMAL then it is pointless to have the stub, remove them. Take also the opportunity to fix checkpatch warnings/errors when moving the code around. Signed-off-by:
-
Daniel Lezcano authored
The structure belongs to the thermal core internals but it is exported in the include/linux/thermal.h For better self-encapsulation and less impact for the compilation if a change is made on it. Move the structure in the thermal core internal header file. Signed-off-by:
-
Daniel Lezcano authored
The default governor set at compilation time is a thermal internal business, no need to export to the global thermal header. Move the config options to the internal header. Signed-off-by:
-
Matthias Kaehlcke authored
Now that devfreq supports limiting the frequency range of a device through PM QoS make use of it instead of disabling OPPs that should not be used. The switch from disabling OPPs to PM QoS introduces a subtle behavioral change in case of conflicting requests (min > max): PM QoS gives precedence to the MIN_FREQUENCY request, while higher OPPs disabled with dev_pm_opp_disable() would override MIN_FREQUENCY. Signed-off-by:
Matthias Kaehlcke <mka@chromium.org> Reviewed-by:
Chanwoo Choi <cw00.choi@samsung.com> Signed-off-by:
-
Daniel Lezcano authored
The last temperature and the current temperature are show via a dev_debug. The line before, those temperature are also traced. It is pointless to duplicate the traces for the temperatures, remove the dev_dbg traces. Signed-off-by:
-
Daniel Lezcano authored
The function thermal_zone_set_trips() is used by the thermal core code in order to update the next trip points, there are no other users. Move the function definition in the thermal_core.h, remove the EXPORT_SYMBOL_GPL and document the function. Signed-off-by:
-
Anson Huang authored
Expose i.MX SC thermal sensors as HWMON devices. Signed-off-by:
Anson Huang <Anson.Huang@nxp.com> Reviewed-by:
-
- 12 Apr, 2020 3 commits
-
-
Linus Torvalds authored
-
Linus Torvalds authored
This sorts the actual field names too, potentially causing even more chaos and confusion at merge time if you have edited the MAINTAINERS file. But the end result is a more consistent layout, and hopefully it's a one-time pain minimized by doing this just before the -rc1 release. This was entirely scripted: ./scripts/parse-maintainers.pl --input=MAINTAINERS --output=MAINTAINERS --order Requested-by:
Joe Perches <joe@perches.com> Signed-off-by:
Linus Torvalds <torvalds@linux-foundation.org>
-
Linus Torvalds authored
They are all supposed to be sorted, but people who add new entries don't always know the alphabet. Plus sometimes the entry names get edited, and people don't then re-order the entry. Let's see how painful this will be for merging purposes (the MAINTAINERS file is often edited in various different trees), but Joe claims there's relatively few patches in -next that touch this, and doing it just before -rc1 is likely the best time. Fingers crossed. This was scripted with /scripts/parse-maintainers.pl --input=MAINTAINERS --output=MAINTAINERS but then I also ended up manually upper-casing a few entry names that stood out when looking at the end result. Requested-by:
-
