- 15 Jul, 2024 37 commits
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Krzysztof Kozlowski authored
Error handling in probe() can be a bit simpler with dev_err_probe(). Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-5-241644e2b6e0@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Simplify the probe() function by using local 'dev' instead of &pdev->dev. While touching devm_kzalloc(), use preferred sizeof(*) syntax. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com> Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-4-241644e2b6e0@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Error handling in probe() can be a bit simpler with dev_err_probe(). Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-3-241644e2b6e0@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Simplify the probe() function by using local 'dev' instead of &pdev->dev. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-2-241644e2b6e0@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
During the probe, driver enables clocks necessary to access registers (in get_temp()) and then registers thermal zone with managed-resources (devm) interface. Removal of device is not done in reversed order, because: 1. Clock will be disabled in driver remove() callback - thermal zone is still registered and accessible to users, 2. devm interface will unregister thermal zone. This leaves short window between (1) and (2) for accessing the get_temp() callback with disabled clock. Fix this by enabling clock also via devm-interface, so entire cleanup path will be in proper, reversed order. Fixes: 8454c8c0 ("thermal/drivers/bcm2835: Remove buggy call to thermal_of_zone_unregister") Cc: stable@vger.kernel.org Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240709-thermal-probe-v1-1-241644e2b6e0@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Rob Herring (Arm) authored
It is possible to have thermal zones which don't have any trip points. These zones in effect simply represent a temperature sensor without any action associated with it. While the schema has always required a 'trips' node, users have existed for a long time without it. Update the schema to match reality. Signed-off-by: Rob Herring (Arm) <robh@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240709150154.3272825-1-robh@kernel.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-12-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Preferred indentation for DTS examples in the bindings is 4-space. It is also preferred not to have redundant/unused labels. No functional change Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Simplify few bindings which already reference thermal-sensor.yaml schema by dropping unneeded requiring of '#thermal-sensor-cells' and dropping assigned-clocks properties (core schema allows it if 'clocks' are there). Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-19-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-18-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-17-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-16-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-15-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Reviewed-by: Heiko Stuebner <heiko@sntech.de> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-14-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-13-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Amit Kucheria <amitk@kernel.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-9-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-8-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-7-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-6-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-5-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Acked-by: Florian Fainelli <florian.fainelli@broadcom.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-4-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and it requires '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it and bring the common definition of '#thermal-sensor-cells' property. Reviewed-by: Vasily Khoruzhick <anarsoul@gmail.com> Acked-by: Chen-Yu Tsai <wens@csie.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-3-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Device is a thermal sensor and all in-tree DTS provide '#thermal-sensor-cells', so reference the thermal-sensor.yaml to simplify it, bring the common definition of '#thermal-sensor-cells' property and require it. Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> Reviewed-by: Guillaume LA ROQUE <glaroque@baylibre.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-2-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
All Samsung Exynos SoCs Thermal Management Units have only one sensor, so make '#thermal-sensor-cells' fixed at 0. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-1-554061b52fbc@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Chen-Yu Tsai authored
On some pre-production hardware, the SoCs do not contain calibration data for the thermal sensors. The downstream drivers provide default values that sort of work, instead of having the thermal sensors not work at all. Port the default values to the upstream driver. These values are from the ChromeOS kernels, which sadly do not cover the MT7988. Signed-off-by: Chen-Yu Tsai <wenst@chromium.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20240620092306.2352606-1-wenst@chromium.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Krzysztof Kozlowski authored
Linux kernel uses thermal zone node name during registering thermal zones and has a hard-coded limit of 20 characters, including terminating NUL byte. The bindings expect node names to finish with '-thermal' which is eight bytes long, thus we have only 11 characters for the reset of the node name (thus 10 for the pattern after leading fixed character). Reported-by: Rob Herring <robh@kernel.org> Closes: https://lore.kernel.org/all/CAL_JsqKogbT_4DPd1n94xqeHaU_J8ve5K09WOyVsRX3jxxUW3w@mail.gmail.com/ Fixes: 1202a442 ("dt-bindings: thermal: Add yaml bindings for thermal zones") Cc: stable@vger.kernel.org Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240702145248.47184-1-krzysztof.kozlowski@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Abel Vesa authored
Document the Temperature Sensor (TSENS) on the X1E80100 Platform. Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Reviewed-by: Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20240628-x1e80100-bindings-thermal-qcom-tsens-v2-1-4843d4c2ba24@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Abdulrasaq Lawani authored
Convert the hisilicon SoCs tsensor txt bindings to dt-schema Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240618-hisilicon-thermal-dt-bindings-conversion-v4-1-7eba97fbe6d0@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Julien Panis authored
Fix thermal zone names for consistency with the other SoCs: - GPU0 must be used as the first GPU item. - SOCx deal with audio DSP, video, and infra subsystems. The naming must be fixed "atomically" so compilation does not break. As a result, the change is made in the dt-bindings and in the LVTS driver within a single commit, despite the checkpatch warning. The definitions can be safely modified here because they are used only in the LVTS driver, which is modified accordingly, and have not yet been included in a released kernel. Fixes: 78c88534 ("dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for MT8188") Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Julien Panis <jpanis@baylibre.com> Link: https://lore.kernel.org/r/20240603-mtk-thermal-mt818x-dtsi-v7-2-8c8e3c7a3643@baylibre.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Julien Panis authored
Fix a thermal zone name for consistency with the other SoCs: MFG contains GPU, the latter is more specific and must be used here. The naming must be fixed "atomically" so compilation does not break. As a result, the change is made in the dt-bindings and in the LVTS driver within a single commit, despite the checkpatch warning. The definition can be safely modified here because it is used only in the LVTS driver, which is modified accordingly, and has not yet been included in a released kernel. Fixes: a2ca2023 ("dt-bindings: thermal: mediatek: Add LVTS thermal controller definition for MT8186") Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Julien Panis <jpanis@baylibre.com> Link: https://lore.kernel.org/r/20240603-mtk-thermal-mt818x-dtsi-v7-1-8c8e3c7a3643@baylibre.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Théo Lebrun authored
This add suspend-to-ram support. The derived_table is kept-as is, so the resume is only about pm_runtime_* calls and restoring the same registers as the probe. Extract the hardware initialization procedure to a function called at both probe-time & resume-time. The probe-time loop is split in two to ensure doing the hardware initialization before registering thermal zones. That ensures our callbacks cannot be called while in bad state. The 100ms delay in the hardware initialization sequence was removed. It was initially added to be sure the thresholds are programmed before enabling the interrupt, but in fact it's not needed (tested on J7200 platform). Signed-off-by: Théo Lebrun <theo.lebrun@bootlin.com> Acked-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Thomas Richard <thomas.richard@bootlin.com> Link: https://lore.kernel.org/r/20240425153238.498750-1-thomas.richard@bootlin.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Niklas Söderlund authored
The R-Car thermal driver depends on OF, describe this. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20240506154011.344324-3-niklas.soderlund+renesas@ragnatech.se
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Niklas Söderlund authored
Move all Renesas thermal drivers to a vendor specific directory. All drivers are moved verbatim apart from the updated include path for thermal_hwmon.h. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20240506154011.344324-2-niklas.soderlund+renesas@ragnatech.se
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- 10 Jul, 2024 1 commit
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Rafael J. Wysocki authored
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- 08 Jul, 2024 1 commit
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Rafael J. Wysocki authored
The order in which lists are sorted in __thermal_zone_device_update() is reverse with respect to what it should be due to a mistake in thermal_trip_notify_cmp(). Fix it and observe that it is not necessary to sort the lists in different orders. They can both be sorted in ascending order if way_down_list is walked in reverse order which allows the code to be slightly more straightforward (and less prone to silly mistakes). Fixes: 7454f2c4 ("thermal: core: Sort trip point crossing notifications by temperature") Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Link: https://patch.msgid.link/12481676.O9o76ZdvQC@rjwysocki.net
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- 04 Jul, 2024 1 commit
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Rafael J. Wysocki authored
Commit 202aa0d4 ("thermal: core: Do not call handle_thermal_trip() if zone temperature is invalid") caused __thermal_zone_device_update() to return early if the current thermal zone temperature was invalid. This was done to avoid running handle_thermal_trip() and governor callbacks in that case which led to confusion. However, it went too far because monitor_thermal_zone() still needs to be called even when the zone temperature is invalid to ensure that it will be updated eventually in case thermal polling is enabled and the driver has no other means to notify the core of zone temperature changes (for example, it does not register an interrupt handler or ACPI notifier). Also if the .set_trips() zone callback is expected to set up monitoring interrupts for a thermal zone, it has to be provided with valid boundaries and that can only happen if the zone temperature is known. Accordingly, to ensure that __thermal_zone_device_update() will run again after a failing zone temperature check, make it call monitor_thermal_zone() regardless of whether or not the zone temperature is valid and make the latter schedule a thermal zone temperature update if the zone temperature is invalid even if polling is not enabled for the thermal zone. Fixes: 202aa0d4 ("thermal: core: Do not call handle_thermal_trip() if zone temperature is invalid") Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org> Tested-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Link: https://patch.msgid.link/2764814.mvXUDI8C0e@rjwysocki.net [ rjw: Changed THERMAL_RECHECK_DELAY_MS to 250 ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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