- 28 Jul, 2022 36 commits
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Daniel Lezcano authored
Self contain the trip initialization from the device tree in a single function for the sake of making the code flow more clear. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
Daniel Lezcano <daniel.lezcano@linexp.org> Link: https://lore.kernel.org/r/20220722200007.1839356-11-daniel.lezcano@linexp.orgSigned-off-by:
Daniel Lezcano <daniel.lezcano@linaro.org>
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Daniel Lezcano authored
Now that we have the thermal trip stored in the thermal zone in a generic way, we can rely on them and remove one indirection we found in the thermal_of code and do one more step forward the removal of the duplicated structures. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
The thermal trip points are properties of a thermal zone and the different sub systems should be able to save them in the thermal zone structure instead of having their own definition. Give the opportunity to the drivers to create a thermal zone with thermal trips which will be accessible directly from the thermal core framework. As we added the thermal trip points structure in the thermal zone, let's extend the thermal zone register function to have the thermal trip structures as a parameter and store it in the 'trips' field of the thermal zone structure. The thermal zone contains the trip point, we can store them directly when registering the thermal zone. That will allow another step forward to remove the duplicate thermal zone structure we find in the thermal_of code. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
In order to use thermal trips defined in the thermal structure, rename the 'trips' field to 'num_trips' to have the 'trips' field containing the thermal trip points. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
The function 'thermal_set_delay_jiffies' is only used in thermal_core.c but it is defined and implemented in a separate file. Move the function to thermal_core.c and make it static. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/20220722200007.1839356-7-daniel.lezcano@linexp.orgSigned-off-by:
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Daniel Lezcano authored
Different functions are exporting the symbols but are actually only used by the thermal framework internals. Remove these EXPORT_SYMBOLS. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
The structure thermal_trip is now generic and will be usable by the different sensor drivers in place of their own structure. Move its definition to thermal.h to make it accessible. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
The device node pointer is no longer needed in the thermal trip structure, remove it. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
The thermal_of code builds a trip array associated with the node pointer in order to compare the trip point phandle with the list. The thermal trip is a thermal zone property and should be moved there. If some sensors have hardcoded trip points, they should use the exported structure instead of redefining again and again their own structure and data to describe exactly the same things. In order to move this to the thermal.h header and allow more cleanup, we need to remove the node pointer from the structure. Instead of building storing the device node, we search directly in the device tree the corresponding node. That results in a simplification of the code and allows to move the structure to thermal.h Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
The pr_err already tells it is an error, it is pointless to add the 'Error:' string in the messages. Remove them. Cc: Alexandre Bailon <abailon@baylibre.com> Cc: Kevin Hilman <khilman@baylibre.com> Signed-off-by:
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Daniel Lezcano authored
As the trip temperature is already available when calling the function handle_critical_trips(), pass it as a parameter instead of having this function calling the ops again to retrieve the same data. Reviewed-by:
Zhang Rui <rui.zhang@intel.com> Signed-off-by:
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Slark Xiao authored
Replace 'the the' with 'the' in the comment. Signed-off-by:
Slark Xiao <slark_xiao@163.com> Link: https://lore.kernel.org/r/20220722104047.83312-1-slark_xiao@163.comSigned-off-by:
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Markus Mayer authored
Include sys/time.h and pthread.h in tmon.h, so that types "pthread_mutex_t" and "struct timeval tv" are known when tmon.h references them. Without these headers, compiling tmon against musl-libc will fail with these errors: In file included from sysfs.c:31:0: tmon.h:47:8: error: unknown type name 'pthread_mutex_t' extern pthread_mutex_t input_lock; ^~~~~~~~~~~~~~~ make[3]: *** [<builtin>: sysfs.o] Error 1 make[3]: *** Waiting for unfinished jobs.... In file included from tui.c:31:0: tmon.h:54:17: error: field 'tv' has incomplete type struct timeval tv; ^~ make[3]: *** [<builtin>: tui.o] Error 1 make[2]: *** [Makefile:83: tmon] Error 2 Signed-off-by:Markus Mayer <mmayer@broadcom.com> Acked-by:
Florian Fainelli <f.fainelli@gmail.com> Reviewed-by:
Sumeet Pawnikar <sumeet.r.pawnikar@intel.com> Acked-by:
Alejandro González <alejandro.gonzalez.correo@gmail.com> Tested-by:
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Jason Wang authored
The double `and' is duplicated in line 229, remove one. Signed-off-by:
Jason Wang <wangborong@cdjrlc.com> Link: https://lore.kernel.org/r/20220715051829.30927-1-wangborong@cdjrlc.comSigned-off-by:
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Dmitry Baryshkov authored
Register thermal zones as hwmon sensors to let userspace read temperatures using standard hwmon interface. Signed-off-by:
Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by:
Bhupesh Sharma <bhupesh.sharma@linaro.org> Link: https://lore.kernel.org/r/20220719054940.755907-2-dmitry.baryshkov@linaro.orgSigned-off-by:
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Dmitry Baryshkov authored
Register thermal zones as hwmon sensors to let userspace read temperatures using standard hwmon interface. Signed-off-by:
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Yang Li authored
The print function dev_err() is redundant because platform_get_irq() already prints an error. Eliminate the follow coccicheck warnings: ./drivers/thermal/db8500_thermal.c:162:2-9: line 162 is redundant because platform_get_irq() already prints an error ./drivers/thermal/db8500_thermal.c:176:2-9: line 176 is redundant because platform_get_irq() already prints an error Signed-off-by:
Yang Li <yang.lee@linux.alibaba.com> Link: https://lore.kernel.org/r/20220719003556.74460-1-yang.lee@linux.alibaba.comSigned-off-by:
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Biju Das authored
This patch replaces 'Capture times'->'Total number of ADC data samples' as the former does not really explain much. It also fixes the typo * caliberation->calibration Lastly, as per the coding style /* should be on a separate line. This patch fixes this issue. Reported-by:
Pavel Machek <pavel@denx.de> Signed-off-by:
Biju Das <biju.das.jz@bp.renesas.com> Link: https://lore.kernel.org/r/20220718121440.556408-1-biju.das.jz@bp.renesas.comSigned-off-by:
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Julia Lawall authored
Spelling mistake (triple letters) in comment. Detected with the help of Coccinelle. Signed-off-by:
Julia Lawall <Julia.Lawall@inria.fr> Acked-by:
Vasily Khoruzhick <anarsoul@gmail.com> Reviewed-by:
Jernej Skrabec <jernej.skrabec@gmail.com> Link: https://lore.kernel.org/r/20220521111145.81697-36-Julia.Lawall@inria.frSigned-off-by:
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Jin Xiaoyun authored
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static Fix sparse warnings: drivers/thermal/k3_j72xx_bandgap.c:532:36: sparse: sparse: symbol 'k3_j72xx_bandgap_j721e_data' was not declared. Should it be static? drivers/thermal/k3_j72xx_bandgap.c:536:36: sparse: sparse: symbol 'k3_j72xx_bandgap_j7200_data' was not declared. Should it be static? Reported-by:
Hulk Robot <hulkci@huawei.com> Signed-off-by:
Jin Xiaoyun <jinxiaoyun2@huawei.com> Link: https://lore.kernel.org/r/20220613063111.654893-1-jinxiaoyun2@huawei.comSigned-off-by:
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Dan Carpenter authored
This while loop exits with "i" set to -1 and so then it sets: derived_table[-1] = derived_table[0] - 300; There is no need for this assignment at all. Just delete it. Fixes: 72b3fc61c752 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support") Signed-off-by:Dan Carpenter <dan.carpenter@oracle.com> Link: https://lore.kernel.org/r/YoetjwcOEzYEFp9b@kiliSigned-off-by:
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Bryan Brattlof authored
If an error occurs in the k3_j72xx_bandgap_probe() function the memory allocated to the 'ref_table' will not be released. Add a err_free_ref_table step to the error path to free 'ref_table' Fixes: 72b3fc61c752 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support") Reported-by:kernel test robot <lkp@intel.com> Reported-by:
Bryan Brattlof <bb@ti.com> Reviewed-by:
Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/20220525213617.30002-1-bb@ti.comSigned-off-by:
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Daniel Lezcano authored
The trends DROP_FULL and RAISE_FULL are not used and were never used in the past AFAICT. Remove these conditions as they seems to not be handled anywhere. Signed-off-by:
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Daniel Lezcano authored
The code is actually clampling the next cooling device state using the lowest and highest states of the thermal instance. That code can be replaced by the clamp() macro which does exactly the same. It results in a simpler routine to read. Signed-off-by:
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Daniel Lezcano authored
The get_trend function relies on the interrupt to set the raising or dropping trend. However the interpolated temperature is already giving the temperature information to the thermal framework which is able to deduce the trend. Remove the trend code. Signed-off-by:
Linus Walleij <linus.walleij@linaro.org> Link: https://lore.kernel.org/r/20220616202537.303655-3-daniel.lezcano@linaro.orgSigned-off-by:
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Daniel Lezcano authored
The get_trend function does already what the generic framework does. Remove it. Signed-off-by:
Dmitry Osipenko <dmitry.osipenko@collabora.com> Link: https://lore.kernel.org/r/20220616202537.303655-2-daniel.lezcano@linaro.orgSigned-off-by:
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Daniel Lezcano authored
There is a get_trend function which is a wrapper to call a private get_trend function. However, this private get_trend function is not assigned anywhere. Remove this dead code. Signed-off-by:
Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20220616202537.303655-1-daniel.lezcano@linaro.orgSigned-off-by:
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Wolfram Sang authored
Add support for R-Car S4. The S4 IP differs a bit from its siblings in such way that it has 3 out of 4 TSC nodes for Linux and the interrupts are not routed to the INTC-AP but to the ECM. Signed-off-by:
Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by:
Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by:
Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by:
Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220610201701.7946-2-wsa+renesas@sang-engineering.comSigned-off-by:
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Wolfram Sang authored
When handling the V3U/r8a779a0 exception, avoid using 'not:' because then its subschemas are far away in the 'else:' branch. Keep them together using positive logic. Signed-off-by:
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Krzysztof Kozlowski authored
Convert the Qualcomm QPNP PMIC Temperature Alarm to DT Schema. Signed-off-by:
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by:
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Wolfram Sang authored
When setting up a new board, a plain "Can't register thermal zone" didn't help me much because the thermal zones in DT were all fine. I just had a sensor entry too much in the parent TSC node. Reword the failure/success messages to contain the sensor number to make it easier to understand which sensor is affected. Example output now: rcar_gen3_thermal e6198000.thermal: Sensor 0: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 1: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 2: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 3: Can't register thermal zone Signed-off-by:
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Lukas Bulwahn authored
Maintainers of the directory Documentation/devicetree/bindings/thermal are also the maintainers of the corresponding directory include/dt-bindings/thermal. Add the file entry for include/dt-bindings/thermal to the appropriate section in MAINTAINERS. Signed-off-by:
Lukas Bulwahn <lukas.bulwahn@gmail.com> Link: https://lore.kernel.org/r/20220613124309.28790-1-lukas.bulwahn@gmail.comSigned-off-by:
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Lukasz Luba authored
Remove unneeded global variable devfreq_cooling_ops which is used only as a copy pattern. Instead, extend the struct devfreq_cooling_device with the needed ops structure. This also simplifies the allocation/free code during the setup/cleanup. Signed-off-by:
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Lukasz Luba authored
The code has moved and left some comments stale. Update them where there is a need. Acked-by:
Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by:
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Lukasz Luba authored
Simplify the thermal_power_cpu_get_power trace event by removing complicated cpumask and variable length array. Now the tools parsing trace output don't have to hassle to get this power data. The simplified format version uses 'policy->cpu'. Remove also the 'load' information completely since there is very little value of it in this trace event. To get the CPUs' load (or utilization) there are other dedicated trace hooks in the kernel. This patch also simplifies and speeds-up the main cooling code when that trace event is enabled. Rename the trace event to avoid confusion of tools which parse the trace file. Acked-by:
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Lukasz Luba authored
It is very unlikely that one CPU cluster would have the EM and some other won't have it (because EM registration failed or DT lacks needed entry). Although, we should avoid modifying global variable with callbacks anyway. Redesign this and add safety for such situation. Signed-off-by:
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- 30 Jun, 2022 1 commit
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Sumeet Pawnikar authored
Add RaptorLake to the list of processor models supported by the Intel TCC cooling driver. Signed-off-by:
Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 25 May, 2022 1 commit
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Sumeet Pawnikar authored
Add Meteor Lake PCI ID for processor thermal device. Signed-off-by:
Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by:
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- 24 May, 2022 2 commits
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pmLinus Torvalds authored
Pull device properties framework updates from Rafael Wysocki: "These mostly extend the device property API and make it easier to use in some cases. Specifics: - Allow error pointer to be passed to fwnode APIs (Andy Shevchenko). - Introduce fwnode_for_each_parent_node() (Andy Shevchenko, Douglas Anderson). - Advertise fwnode and device property count API calls (Andy Shevchenko). - Clean up fwnode_is_ancestor_of() (Andy Shevchenko). - Convert device_{dma_supported,get_dma_attr} to fwnode (Sakari Ailus). - Release subnode properties with data nodes (Sakari Ailus). - Add ->iomap() and ->irq_get() to fwnode operations (Sakari Ailus)" * tag 'devprop-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: device property: Advertise fwnode and device property count API calls device property: Fix recent breakage of fwnode_get_next_parent_dev() device property: Drop 'test' prefix in parameters of fwnode_is_ancestor_of() device property: Introduce fwnode_for_each_parent_node() device property: Allow error pointer to be passed to fwnode APIs ACPI: property: Release subnode properties with data nodes device property: Add irq_get to fwnode operation device property: Add iomap to fwnode operations ACPI: property: Move acpi_fwnode_device_get_match_data() up device property: Convert device_{dma_supported,get_dma_attr} to fwnode -
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pmLinus Torvalds authored
Pull thermal control updates from Rafael Wysocki: "These add a thermal library and thermal tools to wrap the netlink interface into event-based callbacks, improve overheat condition handling during suspend-to-idle on Intel SoCs, add some new hardware support, fix bugs and clean up code. Specifics: - Add thermal library and thermal tools to encapsulate the netlink into event based callbacks (Daniel Lezcano, Jiapeng Chong). - Improve overheat condition handling during suspend-to-idle in the Intel PCH thermal driver (Zhang Rui). - Use local ops instead of global ops in devfreq_cooling (Kant Fan). - Clean up _OSC handling in int340x (Davidlohr Bueso). - Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr() (Hesham Almatary). - Add new k3 j72xx bangdap driver and the corresponding bindings (Keerthy). - Fix missing of_node_put() in the SC iMX driver at probe time (Miaoqian Lin). - Fix memory leak in __thermal_cooling_device_register() when device_register() fails by calling thermal_cooling_device_destroy_sysfs() (Yang Yingliang). - Add sc8180x and sc8280xp compatible string in the DT bindings and lMH support for QCom tsens driver (Bjorn Andersson). - Fix OTP Calibration Register values conforming to the documentation on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das). - Fix type in kerneldoc description for __thermal_bind_params (Corentin Labbe). - Fix potential NULL dereference in sr_thermal_probe() on Broadcom platform (Zheng Yongjun). - Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu Pallikunhi). - Fix non-negative value support by preventing the value to be clamp to zero (Stefan Wahren). - Add compatible string and DT bindings for MSM8960 tsens driver (Dmitry Baryshkov). - Add hwmon support for K3 driver (Massimiliano Minella). - Refactor and add multiple generations support for QCom ADC driver (Jishnu Prakash). - Use platform_get_irq_optional() to get the interrupt on RCar driver and document Document RZ/V2L bindings (Lad Prabhakar). - Remove NULL check after container_of() call from the Intel HFI thermal driver (Haowen Bai)" * tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits) thermal: intel: pch: improve the cooling delay log thermal: intel: pch: enhance overheat handling thermal: intel: pch: move cooling delay to suspend_noirq phase PM: wakeup: expose pm_wakeup_pending to modules thermal: k3_j72xx_bandgap: Add the bandgap driver support dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe thermal/core: Fix memory leak in __thermal_cooling_device_register() dt-bindings: thermal: tsens: Add sc8280xp compatible dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible thermal/drivers/qcom/lmh: Add sc8180x compatible thermal/drivers/rz2gl: Fix OTP Calibration Register values dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings thermal: thermal_of: fix typo on __thermal_bind_params tools/thermal: remove unneeded semicolon tools/lib/thermal: remove unneeded semicolon thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe tools/thermal: Add thermal daemon skeleton tools/thermal: Add a temperature capture tool tools/thermal: Add util library ...
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